Intel Xeon Phi 7295 vs AMD Ryzen 3 PRO 2300U
Comparative analysis of Intel Xeon Phi 7295 and AMD Ryzen 3 PRO 2300U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Xeon Phi 7295
- CPU is newer: launch date 2 month(s) later
- 68 more cores, run more applications at once: 72 vs 4
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 18x more L2 cache, more data can be stored in the L2 cache for quick access later
| Launch date | December 2017 vs October 2017 |
| Number of cores | 72 vs 4 |
| L1 cache | 32 KB (per core) vs 384 KB |
| L2 cache | 512 KB (per core) vs 2 MB |
Reasons to consider the AMD Ryzen 3 PRO 2300U
- Around 113% higher clock speed: 3.4 GHz vs 1.60 GHz
- Around 23% higher maximum core temperature: 95°C vs 77°C
- 21.3x lower typical power consumption: 15 Watt vs 320 Watt
| Maximum frequency | 3.4 GHz vs 1.60 GHz |
| Maximum core temperature | 95°C vs 77°C |
| Thermal Design Power (TDP) | 15 Watt vs 320 Watt |
Compare benchmarks
CPU 1: Intel Xeon Phi 7295
CPU 2: AMD Ryzen 3 PRO 2300U
| Name | Intel Xeon Phi 7295 | AMD Ryzen 3 PRO 2300U |
|---|---|---|
| PassMark - Single thread mark | 1832 | |
| PassMark - CPU mark | 5742 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 21.798 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 279.682 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.746 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 27.185 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 96.109 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1321 | |
| GFXBench 4.0 - Manhattan (Frames) | 1384 | |
| GFXBench 4.0 - T-Rex (Frames) | 4594 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1321 | |
| GFXBench 4.0 - Manhattan (Fps) | 1384 | |
| GFXBench 4.0 - T-Rex (Fps) | 4594 |
Compare specifications (specs)
| Intel Xeon Phi 7295 | AMD Ryzen 3 PRO 2300U | |
|---|---|---|
Essentials |
||
| Architecture codename | Knights Mill | Raven Ridge |
| Launch date | December 2017 | October 2017 |
| Place in performance rating | not rated | 927 |
| Processor Number | 7295 | |
| Series | Intel® Xeon Phi™ 72x5 Processor Family | AMD Ryzen 3 PRO Mobile Processors with Radeon Vega Graphics |
| Status | Launched | |
| Vertical segment | Server | Laptop |
| Family | AMD Ryzen PRO Processors | |
| OPN Tray | YM230BC4T4MFB | |
| OS Support | Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.50 GHz | 2 GHz |
| L1 cache | 32 KB (per core) | 384 KB |
| L2 cache | 512 KB (per core) | 2 MB |
| Manufacturing process technology | 14 nm | 14 nm |
| Maximum core temperature | 77°C | 95°C |
| Maximum frequency | 1.60 GHz | 3.4 GHz |
| Number of cores | 72 | 4 |
| Transistor count | 8000 million | |
| VID voltage range | 0.550-1.200V | |
| Die size | 246 mm | |
| L3 cache | 4 MB | |
| Number of GPU cores | 6 | |
| Number of threads | 4 | |
| Unlocked | ||
Memory |
||
| Max memory channels | 6 | 2 |
| Maximum memory bandwidth | 115.2 GB/s | |
| Maximum memory size | 384 GB | |
| Supported memory types | DDR4-2400 | DDR4 |
| Supported memory frequency | 2400 MHz | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | SVLCLGA3647 | FP5 |
| Thermal Design Power (TDP) | 320 Watt | 15 Watt |
| Configurable TDP | 12-25 Watt | |
| Thermal Solution | Not included | |
Peripherals |
||
| Max number of PCIe lanes | 36 | |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port 1) may negotiate down to x2, or x1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Idle States | ||
| Instruction set extensions | Intel® AVX-512 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| AMD SenseMI | ||
| The "Zen" Core Architecture | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
Graphics |
||
| Graphics max frequency | 1100 MHz | |
| iGPU core count | 6 | |
| Processor graphics | Radeon Vega 6 Graphics | |
Graphics interfaces |
||
| DisplayPort | ||
| HDMI | ||
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