Intel Xeon W-1350 vs Intel Core i3-2102

Comparative analysis of Intel Xeon W-1350 and Intel Core i3-2102 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon W-1350

  • CPU is newer: launch date 9 year(s) 11 month(s) later
  • 4 more cores, run more applications at once: 6 vs 2
  • 8 more threads: 12 vs 4
  • Around 61% higher clock speed: 5.00 GHz vs 3.1 GHz
  • Around 45% higher maximum core temperature: 100°C vs 69.1°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
  • 3.8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 6x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 4x more L3 cache, more data can be stored in the L3 cache for quick access later
  • 4x more maximum memory size: 128 GB vs 32 GB
  • 2.5x better performance in PassMark - Single thread mark: 3463 vs 1400
  • 9.3x better performance in PassMark - CPU mark: 18775 vs 2029
Specifications (specs)
Launch date 6 May 2021 vs June 2011
Number of cores 6 vs 2
Number of threads 12 vs 4
Maximum frequency 5.00 GHz vs 3.1 GHz
Maximum core temperature 100°C vs 69.1°C
Manufacturing process technology 14 nm vs 32 nm
L1 cache 480 KB vs 64 KB (per core)
L2 cache 3 MB vs 256 KB (per core)
L3 cache 12 MB vs 3072 KB (shared)
Maximum memory size 128 GB vs 32 GB
Benchmarks
PassMark - Single thread mark 3463 vs 1400
PassMark - CPU mark 18775 vs 2029

Reasons to consider the Intel Core i3-2102

  • Around 23% lower typical power consumption: 65 Watt vs 80 Watt
Thermal Design Power (TDP) 65 Watt vs 80 Watt

Compare benchmarks

CPU 1: Intel Xeon W-1350
CPU 2: Intel Core i3-2102

PassMark - Single thread mark
CPU 1
CPU 2
3463
1400
PassMark - CPU mark
CPU 1
CPU 2
18775
2029
Name Intel Xeon W-1350 Intel Core i3-2102
PassMark - Single thread mark 3463 1400
PassMark - CPU mark 18775 2029

Compare specifications (specs)

Intel Xeon W-1350 Intel Core i3-2102

Essentials

Architecture codename Rocket Lake Sandy Bridge
Launch date 6 May 2021 June 2011
Launch price (MSRP) $255 - $258
Place in performance rating 388 1825
Processor Number W-1350 i3-2102
Series Intel Xeon W Processor Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Workstation Desktop
Price now $58
Value for money (0-100) 18.97

Performance

64 bit support
Base frequency 3.30 GHz 3.10 GHz
Bus Speed 8 GT/s 5 GT/s DMI
L1 cache 480 KB 64 KB (per core)
L2 cache 3 MB 256 KB (per core)
L3 cache 12 MB 3072 KB (shared)
Manufacturing process technology 14 nm 32 nm
Maximum core temperature 100°C 69.1°C
Maximum frequency 5.00 GHz 3.1 GHz
Number of cores 6 2
Number of threads 12 4
Die size 131 mm
Transistor count 504 million

Memory

Max memory channels 2 2
Maximum memory bandwidth 50 GB/s 21 GB/s
Maximum memory size 128 GB 32 GB
Supported memory types DDR4-3200 DDR3 1066/1333

Graphics

Device ID 0x4C90 0x102
Execution Units 32
Graphics base frequency 350 MHz 850 MHz
Graphics max dynamic frequency 1.30 GHz 1.10 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel UHD Graphics P750 Intel® HD Graphics 2000
Graphics max frequency 1.1 GHz
Intel® Flexible Display Interface (Intel® FDI)

Graphics interfaces

Number of displays supported 3 2
Wireless Display (WiDi) support

Graphics image quality

4K resolution support
Max resolution over DisplayPort 5120 x 3200 @60Hz
Max resolution over eDP 5120 x 3200 @60Hz

Graphics API support

DirectX 12.1
OpenGL 4.5

Compatibility

Max number of CPUs in a configuration 1 1
Package Size 37.5 mm x 37.5 mm 37.5mm x 37.5mm
Sockets supported FCLGA1200 FCLGA1155
Thermal Design Power (TDP) 80 Watt 65 Watt
Thermal Solution PCG 2019B
Low Halogen Options Available

Peripherals

Max number of PCIe lanes 20 16
PCI Express revision 4.0 2.0
PCIe configurations Up to 1x16+1x4, 2x8+1x4, 1x8+3x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)