Intel Xeon W-2275 vs AMD Ryzen 9 3950X
Comparative analysis of Intel Xeon W-2275 and AMD Ryzen 9 3950X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-2275
- Around 75% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 2% better performance in PassMark - Single thread mark: 2752 vs 2704
Specifications (specs) | |
L2 cache | 14 MB vs 8 MB |
Benchmarks | |
PassMark - Single thread mark | 2752 vs 2704 |
Reasons to consider the AMD Ryzen 9 3950X
- CPU is newer: launch date 1 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 16 vs 14
- 4 more threads: 32 vs 28
- Around 2% higher clock speed: 4.7 GHz vs 4.60 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 14% more L1 cache; more data can be stored in the L1 cache for quick access later
- 3.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 57% lower typical power consumption: 105 Watt vs 165 Watt
- Around 39% better performance in PassMark - CPU mark: 38737 vs 27866
Specifications (specs) | |
Launch date | 25 Nov 2019 vs 7 Oct 2019 |
Unlocked | Unlocked vs Locked |
Number of cores | 16 vs 14 |
Number of threads | 32 vs 28 |
Maximum frequency | 4.7 GHz vs 4.60 GHz |
Manufacturing process technology | 7 nm vs 14 nm |
L1 cache | 1 MB vs 896 KB |
L3 cache | 64 MB vs 19.25 MB |
Thermal Design Power (TDP) | 105 Watt vs 165 Watt |
Benchmarks | |
PassMark - CPU mark | 38737 vs 27866 |
Compare benchmarks
CPU 1: Intel Xeon W-2275
CPU 2: AMD Ryzen 9 3950X
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-2275 | AMD Ryzen 9 3950X |
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PassMark - Single thread mark | 2752 | 2704 |
PassMark - CPU mark | 27866 | 38737 |
Geekbench 4 - Single Core | 1296 | |
Geekbench 4 - Multi-Core | 14150 | |
3DMark Fire Strike - Physics Score | 10742 |
Compare specifications (specs)
Intel Xeon W-2275 | AMD Ryzen 9 3950X | |
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Essentials |
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Architecture codename | Cascade Lake | Zen 2 |
Launch date | 7 Oct 2019 | 25 Nov 2019 |
Launch price (MSRP) | $1112 | $749 |
Place in performance rating | 580 | 582 |
Processor Number | W-2275 | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | Desktop |
OPN PIB | 100-100000051WOF | |
OPN Tray | 100-000000051 | |
Performance |
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64 bit support | ||
Base frequency | 3.30 GHz | 3.5 GHz |
Bus Speed | 8 GT/s | |
L1 cache | 896 KB | 1 MB |
L2 cache | 14 MB | 8 MB |
L3 cache | 19.25 MB | 64 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 62°C | |
Maximum frequency | 4.60 GHz | 4.7 GHz |
Number of cores | 14 | 16 |
Number of QPI Links | 0 | |
Number of threads | 28 | 32 |
Number of Ultra Path Interconnect (UPI) Links | 0 | |
Unlocked | ||
Memory |
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Max memory channels | 4 | 2 |
Maximum memory bandwidth | 93.85 GB/s | |
Maximum memory size | 1 TB | |
Supported memory types | DDR4 2933 | DDR4-3200 |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Package Size | 45mm x 52.5mm | |
Sockets supported | FCLGA2066 | AM4 |
Thermal Design Power (TDP) | 165 Watt | 105 Watt |
Peripherals |
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Max number of PCIe lanes | 48 | 40 |
PCI Express revision | 3.0 | 4.0 |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 2 | |
Physical Address Extensions (PAE) | 46-bit | |
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |