Intel Xeon X7350 vs AMD Opteron 6278
Comparative analysis of Intel Xeon X7350 and AMD Opteron 6278 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon X7350
- Around 18% better performance in PassMark - Single thread mark: 1186 vs 1007
Benchmarks | |
PassMark - Single thread mark | 1186 vs 1007 |
Reasons to consider the AMD Opteron 6278
- 12 more cores, run more applications at once: 16 vs 4
- Around 5% higher maximum core temperature: 69°C vs 66°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 2097152x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 13% lower typical power consumption: 115 Watt vs 130 Watt
- Around 75% better performance in PassMark - CPU mark: 13733 vs 7836
Specifications (specs) | |
Number of cores | 16 vs 4 |
Maximum core temperature | 69°C vs 66°C |
Manufacturing process technology | 32 nm vs 65 nm |
L3 cache | 16 MB vs 8 MB L2 Cache |
Thermal Design Power (TDP) | 115 Watt vs 130 Watt |
Benchmarks | |
PassMark - CPU mark | 13733 vs 7836 |
Compare benchmarks
CPU 1: Intel Xeon X7350
CPU 2: AMD Opteron 6278
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon X7350 | AMD Opteron 6278 |
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PassMark - Single thread mark | 1186 | 1007 |
PassMark - CPU mark | 7836 | 13733 |
Compare specifications (specs)
Intel Xeon X7350 | AMD Opteron 6278 | |
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Essentials |
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Architecture codename | Tigerton | Interlagos |
Launch date | Q3'07 | May 2012 |
Place in performance rating | 1853 | 1857 |
Processor Number | X7350 | |
Series | Legacy Intel Xeon Processors | AMD Opteron 6200 Series Processor |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN Tray | OS6278WKTGGGU | |
Performance |
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64 bit support | ||
Base frequency | 2.93 GHz | 2.4 GHz |
Bus Speed | 1066 MHz | |
Die size | 286 mm2 | 316 mm |
L3 cache | 8 MB L2 Cache | 16 MB |
Manufacturing process technology | 65 nm | 32 nm |
Maximum core temperature | 66°C | 69°C |
Number of cores | 4 | 16 |
Transistor count | 582 million | 2400 million |
VID voltage range | 1.0000V-1.5000V | |
L1 cache | 768 KB | |
L2 cache | 16 MB | |
Maximum frequency | 3.3 GHz | |
Number of threads | 16 | |
Unlocked | ||
Compatibility |
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Package Size | 53.3mm x 53.3mm | |
Sockets supported | PGA604, PPGA604 | G34 |
Thermal Design Power (TDP) | 130 Watt | 115 Watt |
Max number of CPUs in a configuration | 4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
AMD Virtualization (AMD-V™) | ||
Memory |
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Supported memory frequency | 2000 MHz | |
Supported memory types | DDR3 |