Intel Xeon X7350 vs Intel Xeon E5-1650 v2
Comparative analysis of Intel Xeon X7350 and Intel Xeon E5-1650 v2 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-1650 v2
- 2 more cores, run more applications at once: 6 vs 4
- Around 6% higher maximum core temperature: 70°C vs 66°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 1572864x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 73% better performance in PassMark - Single thread mark: 2049 vs 1186
- Around 19% better performance in PassMark - CPU mark: 9333 vs 7836
| Specifications (specs) | |
| Number of cores | 6 vs 4 |
| Maximum core temperature | 70°C vs 66°C |
| Manufacturing process technology | 22 nm vs 65 nm |
| L3 cache | 12288 KB (shared) vs 8 MB L2 Cache |
| Benchmarks | |
| PassMark - Single thread mark | 2049 vs 1186 |
| PassMark - CPU mark | 9333 vs 7836 |
Compare benchmarks
CPU 1: Intel Xeon X7350
CPU 2: Intel Xeon E5-1650 v2
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon X7350 | Intel Xeon E5-1650 v2 |
|---|---|---|
| PassMark - Single thread mark | 1186 | 2049 |
| PassMark - CPU mark | 7836 | 9333 |
| Geekbench 4 - Single Core | 783 | |
| Geekbench 4 - Multi-Core | 4838 | |
| 3DMark Fire Strike - Physics Score | 5795 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.106 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 67.646 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.842 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.4 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.992 |
Compare specifications (specs)
| Intel Xeon X7350 | Intel Xeon E5-1650 v2 | |
|---|---|---|
Essentials |
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| Architecture codename | Tigerton | Ivy Bridge EP |
| Launch date | Q3'07 | September 2013 |
| Place in performance rating | 1878 | 1884 |
| Processor Number | X7350 | E5-1650V2 |
| Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E5 v2 Family |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $917 | |
| Price now | $644.95 | |
| Status | Launched | |
| Value for money (0-100) | 5.81 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.93 GHz | 3.50 GHz |
| Bus Speed | 1066 MHz | 0 GT/s QPI |
| Die size | 286 mm2 | 160 mm |
| L3 cache | 8 MB L2 Cache | 12288 KB (shared) |
| Manufacturing process technology | 65 nm | 22 nm |
| Maximum core temperature | 66°C | 70°C |
| Number of cores | 4 | 6 |
| Transistor count | 582 million | 1400 million |
| VID voltage range | 1.0000V-1.5000V | 0.65–1.30V |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| Maximum frequency | 3.90 GHz | |
| Number of QPI Links | 0 | |
| Number of threads | 12 | |
Compatibility |
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| Package Size | 53.3mm x 53.3mm | 52.5mm x 45.0 mm |
| Sockets supported | PGA604, PPGA604 | FCLGA2011 |
| Thermal Design Power (TDP) | 130 Watt | 130 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Instruction set extensions | Intel® AVX | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Flex Memory Access | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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| ECC memory support | ||
| Max memory channels | 4 | |
| Maximum memory bandwidth | 59.7 GB/s | |
| Maximum memory size | 256 GB | |
| Supported memory types | DDR3 800/1066/1333/1600/1866 | |
Peripherals |
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| Max number of PCIe lanes | 40 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | x4, x8, x16 | |
| Scalability | 1S Only | |
