Intel Xeon X7350 vs Intel Xeon W-2150B
Comparative analysis of Intel Xeon X7350 and Intel Xeon W-2150B processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon W-2150B
- 6 more cores, run more applications at once: 10 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
- 1802240x more L3 cache, more data can be stored in the L3 cache for quick access later
| Number of cores | 10 vs 4 |
| Manufacturing process technology | 14 nm vs 65 nm |
| L3 cache | 13.75 MB vs 8 MB L2 Cache |
Compare benchmarks
CPU 1: Intel Xeon X7350
CPU 2: Intel Xeon W-2150B
| Name | Intel Xeon X7350 | Intel Xeon W-2150B |
|---|---|---|
| PassMark - Single thread mark | 1186 | |
| PassMark - CPU mark | 7836 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 12.765 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 118.786 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.936 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 6.855 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 17.598 |
Compare specifications (specs)
| Intel Xeon X7350 | Intel Xeon W-2150B | |
|---|---|---|
Essentials |
||
| Architecture codename | Tigerton | Skylake W |
| Launch date | Q3'07 | 5 June 2017 |
| Place in performance rating | 1878 | 1892 |
| Processor Number | X7350 | W-2150B |
| Series | Legacy Intel Xeon Processors | W-2000 |
| Vertical segment | Server | Server |
| Family | Xeon W | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.93 GHz | 3.0 GHz |
| Bus Speed | 1066 MHz | 8 GT/s DMI |
| Die size | 286 mm2 | |
| L3 cache | 8 MB L2 Cache | 13.75 MB |
| Manufacturing process technology | 65 nm | 14 nm |
| Maximum core temperature | 66°C | |
| Number of cores | 4 | 10 |
| Transistor count | 582 million | |
| VID voltage range | 1.0000V-1.5000V | |
| L1 cache | 640 KB | |
| L2 cache | 10 MB | |
| Maximum frequency | 4.5 GHz | |
| Number of threads | 20 | |
Compatibility |
||
| Package Size | 53.3mm x 53.3mm | |
| Sockets supported | PGA604, PPGA604 | FCLGA-2066 (R4) |
| Thermal Design Power (TDP) | 130 Watt | |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
| Speed Shift technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 4 | |
| Maximum memory bandwidth | 79.47 GB/s | |
| Maximum memory size | 512 GB | |
| Supported memory types | DDR4-2666 | |
Peripherals |
||
| Max number of PCIe lanes | 48 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | 1x16, 1x8, 1x4 | |
