Intel Xeon X7460 vs AMD Opteron 3260 HE
Comparative analysis of Intel Xeon X7460 and AMD Opteron 3260 HE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon X7460
- 2 more cores, run more applications at once: 6 vs 4
- Around 5% higher maximum core temperature: 64°C vs 61.10°C
- Around 2% better performance in PassMark - Single thread mark: 922 vs 900
- 2.1x better performance in PassMark - CPU mark: 4803 vs 2283
Specifications (specs) | |
Number of cores | 6 vs 4 |
Maximum core temperature | 64°C vs 61.10°C |
Benchmarks | |
PassMark - Single thread mark | 922 vs 900 |
PassMark - CPU mark | 4803 vs 2283 |
Reasons to consider the AMD Opteron 3260 HE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 262144x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.9x lower typical power consumption: 45 Watt vs 130 Watt
Manufacturing process technology | 32 nm vs 45 nm |
L3 cache | 4 MB vs 16 MB L2 Cache |
Thermal Design Power (TDP) | 45 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon X7460
CPU 2: AMD Opteron 3260 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon X7460 | AMD Opteron 3260 HE |
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PassMark - Single thread mark | 922 | 900 |
PassMark - CPU mark | 4803 | 2283 |
Compare specifications (specs)
Intel Xeon X7460 | AMD Opteron 3260 HE | |
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Essentials |
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Architecture codename | Dunnington | |
Launch date | Q3'08 | |
Place in performance rating | 2244 | 2355 |
Processor Number | X7460 | |
Series | Legacy Intel Xeon Processors | AMD Opteron 3200 Series Processor |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN PIB | OS3260HOW4MGUBOX | |
OPN Tray | OS3260HOW4MGU | |
Performance |
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64 bit support | ||
Base frequency | 2.66 GHz | 2.7 GHz |
Bus Speed | 1066 MHz | |
Die size | 503 mm2 | |
L3 cache | 16 MB L2 Cache | 4 MB |
Manufacturing process technology | 45 nm | 32 nm |
Maximum core temperature | 64°C | 61.10°C |
Number of cores | 6 | 4 |
Transistor count | 1900 million | |
VID voltage range | 0.9000V-1.4500V | |
L1 cache | 192 KB | |
L2 cache | 4 MB | |
Maximum frequency | 3.7 GHz | |
Number of threads | 4 | |
Unlocked | ||
Compatibility |
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Package Size | 53.3mm x 53.3mm | |
Sockets supported | PGA604 | AM3+ |
Thermal Design Power (TDP) | 130 Watt | 45 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory frequency | 2000 MHz | |
Supported memory types | DDR3 |