Intel Xeon w9-3475X vs AMD Ryzen 9 7900X3D
Comparative analysis of Intel Xeon w9-3475X and AMD Ryzen 9 7900X3D processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon w9-3475X
- CPU is newer: launch date 1 month(s) later
- 24 more cores, run more applications at once: 36 vs 12
- 48 more threads: 72 vs 24
- 3.8x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 29% better performance in PassMark - CPU mark: 64889 vs 50398
Specifications (specs) | |
Launch date | 15 Feb 2023 vs 4 Jan 2023 |
Number of cores | 36 vs 12 |
Number of threads | 72 vs 24 |
L1 cache | 80K (per core) vs 768 KB |
Benchmarks | |
PassMark - CPU mark | 64889 vs 50398 |
Reasons to consider the AMD Ryzen 9 7900X3D
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 17% higher clock speed: 5.6 GHz vs 4.80 GHz
- Around 20% higher maximum core temperature: 89 °C vs 74
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm
- 174762.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 55% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.5x lower typical power consumption: 120 Watt vs 300 Watt
- Around 22% better performance in PassMark - Single thread mark: 4133 vs 3392
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 5.6 GHz vs 4.80 GHz |
Maximum core temperature | 89 °C vs 74 |
Manufacturing process technology | 5 nm vs 7 nm |
L2 cache | 12 MB vs 2MB (per core) |
L3 cache | 128 MB vs 82.5 MB (shared) |
Thermal Design Power (TDP) | 120 Watt vs 300 Watt |
Benchmarks | |
PassMark - Single thread mark | 4133 vs 3392 |
Compare benchmarks
CPU 1: Intel Xeon w9-3475X
CPU 2: AMD Ryzen 9 7900X3D
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon w9-3475X | AMD Ryzen 9 7900X3D |
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PassMark - Single thread mark | 3392 | 4133 |
PassMark - CPU mark | 64889 | 50398 |
3DMark Fire Strike - Physics Score | 11579 |
Compare specifications (specs)
Intel Xeon w9-3475X | AMD Ryzen 9 7900X3D | |
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Essentials |
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Architecture codename | Sapphire Rapids | Zen 4 |
Launch date | 15 Feb 2023 | 4 Jan 2023 |
Launch price (MSRP) | $3739 | |
Place in performance rating | 100 | 108 |
Processor Number | w9-3475X | |
Series | Intel Xeon W Processor | |
Vertical segment | Workstation | Desktop |
OPN Tray | 100-000000909 | |
Performance |
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64 bit support | ||
Base frequency | 2.20 GHz | 4.4 GHz |
L1 cache | 80K (per core) | 768 KB |
L2 cache | 2MB (per core) | 12 MB |
L3 cache | 82.5 MB (shared) | 128 MB |
Manufacturing process technology | 7 nm | 5 nm |
Maximum core temperature | 74 | 89 °C |
Maximum frequency | 4.80 GHz | 5.6 GHz |
Number of cores | 36 | 12 |
Number of threads | 72 | 24 |
Die size | 71 mm² | |
Maximum case temperature (TCase) | 47 °C | |
Transistor count | 13140 million | |
Unlocked | ||
Memory |
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Max memory channels | 8 | 2 |
Maximum memory size | 4 TB | |
Supported memory frequency | 4800 MHz | |
Supported memory types | DDR5-4800 (MT/s) | DDR5-5200 |
ECC memory support | ||
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 77.5mm x 56.5mm | |
Sockets supported | FCLGA4677 | AM5 |
Thermal Design Power (TDP) | 300 Watt | 120 Watt |
Peripherals |
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Max number of PCIe lanes | 112 | 24 |
PCI Express revision | 5.0 | 5.0 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel SSE4.1, Intel AMX, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |