AMD FirePro 2270 videocard review
FirePro 2270 videocard released by AMD; release date: 31 January 2011. The videocard is designed for workstation-computers and based on TeraScale 2 microarchitecture codenamed Cedar.
Core clock speed - 600 MHz. Texture fill rate - 4.8 GTexel / s. Pipelines - 80. Floating-point performance - 96 gflops. Manufacturing process technology - 40 nm. Transistors count - 292 million. Power consumption (TDP) - 15 Watt.
Memory type: GDDR3. Maximum RAM amount - 512 MB. Memory bus width - 64 Bit. Memory clock speed - 1200 MHz. Memory bandwidth - 9.6 GB / s.
Benchmarks
PassMark G3D Mark |
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PassMark G2D Mark |
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Geekbench OpenCL |
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CompuBench 1.5 Desktop T-Rex |
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CompuBench 1.5 Desktop Bitcoin Mining |
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GFXBench 4.0 Manhattan |
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GFXBench 4.0 Manhattan |
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GFXBench 4.0 T-Rex |
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GFXBench 4.0 T-Rex |
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Name | Value |
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PassMark - G3D Mark | 142 |
PassMark - G2D Mark | 173 |
Geekbench - OpenCL | 2564 |
CompuBench 1.5 Desktop - T-Rex | 0.145 Frames/s |
CompuBench 1.5 Desktop - Bitcoin Mining | 9.382 mHash/s |
GFXBench 4.0 - Manhattan | 539 Frames |
GFXBench 4.0 - Manhattan | 539.000 Fps |
GFXBench 4.0 - T-Rex | 1231 Frames |
GFXBench 4.0 - T-Rex | 1231.000 Fps |
Specifications (specs)
Essentials |
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Architecture | TeraScale 2 |
Code name | Cedar |
Launch date | 31 January 2011 |
Place in performance rating | 1540 |
Type | Workstation |
Technical info |
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Core clock speed | 600 MHz |
Floating-point performance | 96 gflops |
Manufacturing process technology | 40 nm |
Pipelines | 80 |
Texture fill rate | 4.8 GTexel / s |
Thermal Design Power (TDP) | 15 Watt |
Transistor count | 292 million |
Video outputs and ports |
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Display Connectors | 1x DMS-59 |
Compatibility, dimensions and requirements |
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Interface | PCIe 2.0 x16 |
Length | 170 mm |
Supplementary power connectors | None |
API support |
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DirectX | 11.2 (11_0) |
OpenGL | 4.4 |
Memory |
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Maximum RAM amount | 512 MB |
Memory bandwidth | 9.6 GB / s |
Memory bus width | 64 Bit |
Memory clock speed | 1200 MHz |
Memory type | GDDR3 |