AMD FirePro 2270 videocard review

AMD FirePro 2270

FirePro 2270 videocard released by AMD; release date: 31 January 2011. The videocard is designed for workstation-computers and based on TeraScale 2 microarchitecture codenamed Cedar.

Core clock speed - 600 MHz. Texture fill rate - 4.8 GTexel / s. Pipelines - 80. Floating-point performance - 96 gflops. Manufacturing process technology - 40 nm. Transistors count - 292 million. Power consumption (TDP) - 15 Watt.

Memory type: GDDR3. Maximum RAM amount - 512 MB. Memory bus width - 64 Bit. Memory clock speed - 1200 MHz. Memory bandwidth - 9.6 GB / s.

Benchmarks

PassMark
G3D Mark
Top 1 GPU
This GPU
38588
142
PassMark
G2D Mark
Top 1 GPU
This GPU
1295
173
Geekbench
OpenCL
Top 1 GPU
This GPU
345150
2564
CompuBench 1.5 Desktop
T-Rex
Top 1 GPU
This GPU
95.851 Frames/s
0.145 Frames/s
CompuBench 1.5 Desktop
Bitcoin Mining
Top 1 GPU
This GPU
4429.590 mHash/s
9.382 mHash/s
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823 Frames
539 Frames
GFXBench 4.0
Manhattan
Top 1 GPU
This GPU
27823.000 Fps
539.000 Fps
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225 Frames
1231 Frames
GFXBench 4.0
T-Rex
Top 1 GPU
This GPU
69225.000 Fps
1231.000 Fps
Name Value
PassMark - G3D Mark 142
PassMark - G2D Mark 173
Geekbench - OpenCL 2564
CompuBench 1.5 Desktop - T-Rex 0.145 Frames/s
CompuBench 1.5 Desktop - Bitcoin Mining 9.382 mHash/s
GFXBench 4.0 - Manhattan 539 Frames
GFXBench 4.0 - Manhattan 539.000 Fps
GFXBench 4.0 - T-Rex 1231 Frames
GFXBench 4.0 - T-Rex 1231.000 Fps

Specifications (specs)

Essentials

Architecture TeraScale 2
Code name Cedar
Launch date 31 January 2011
Place in performance rating 1540
Type Workstation

Technical info

Core clock speed 600 MHz
Floating-point performance 96 gflops
Manufacturing process technology 40 nm
Pipelines 80
Texture fill rate 4.8 GTexel / s
Thermal Design Power (TDP) 15 Watt
Transistor count 292 million

Video outputs and ports

Display Connectors 1x DMS-59

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16
Length 170 mm
Supplementary power connectors None

API support

DirectX 11.2 (11_0)
OpenGL 4.4

Memory

Maximum RAM amount 512 MB
Memory bandwidth 9.6 GB / s
Memory bus width 64 Bit
Memory clock speed 1200 MHz
Memory type GDDR3