AMD FirePro W9100 videocard review
FirePro W9100 videocard released by AMD; release date: 26 March 2014. The videocard is designed for workstation-computers and based on GCN 2.0 microarchitecture codenamed Hawaii.
Core clock speed - 930 MHz. Texture fill rate - 163.7 GTexel / s. Pipelines - 2816. Floating-point performance - 5,238 gflops. Manufacturing process technology - 28 nm. Transistors count - 6,200 million. Power consumption (TDP) - 750 Watt.
Memory type: GDDR5. Maximum RAM amount - 16 GB. Memory bus width - 512 Bit. Memory clock speed - 5000 MHz. Memory bandwidth - 320 GB / s.
Benchmarks
| PassMark G3D Mark |
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| PassMark G2D Mark |
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| Geekbench OpenCL |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| Name | Value |
|---|---|
| PassMark - G3D Mark | 7987 |
| PassMark - G2D Mark | 752 |
| Geekbench - OpenCL | 43046 |
| CompuBench 1.5 Desktop - Face Detection | 106.585 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 1878.403 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 9.751 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 82.208 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 511.115 mHash/s |
| GFXBench 4.0 - Car Chase Offscreen | 9143 Frames |
| GFXBench 4.0 - Manhattan | 8219 Frames |
| GFXBench 4.0 - T-Rex | 32085 Frames |
| GFXBench 4.0 - Car Chase Offscreen | 9143.000 Fps |
| GFXBench 4.0 - Manhattan | 8219.000 Fps |
| GFXBench 4.0 - T-Rex | 32085.000 Fps |
Specifications (specs)
Essentials |
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| Architecture | GCN 2.0 |
| Code name | Hawaii |
| Launch date | 26 March 2014 |
| Place in performance rating | 189 |
| Type | Workstation |
Technical info |
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| Core clock speed | 930 MHz |
| Floating-point performance | 5,238 gflops |
| Manufacturing process technology | 28 nm |
| Pipelines | 2816 |
| Texture fill rate | 163.7 GTexel / s |
| Thermal Design Power (TDP) | 750 Watt |
| Transistor count | 6,200 million |
Video outputs and ports |
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| Display Connectors | 6x mini-DisplayPort, 1x S-Video |
| Dual-link DVI support | |
| HD сomponent video output | |
| StereoOutput3D | |
Compatibility, dimensions and requirements |
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| Bus support | PCIe 3.0 |
| Form factor | Full Height / Full Length |
| Interface | PCIe 3.0 x16 |
| Length | 275 mm |
| Supplementary power connectors | 1x 6-pin + 1x 8-pin |
API support |
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| DirectX | 12.0 (12_0) |
| OpenGL | 4.6 |
Memory |
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| Maximum RAM amount | 16 GB |
| Memory bandwidth | 320 GB / s |
| Memory bus width | 512 Bit |
| Memory clock speed | 5000 MHz |
| Memory type | GDDR5 |
Navigation
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