AMD Radeon HD 8350 OEM vs ATI Radeon 9100

Comparative analysis of AMD Radeon HD 8350 OEM and ATI Radeon 9100 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

AMD Radeon HD 8350 OEM

ATI Radeon 9100

Differences

Reasons to consider the AMD Radeon HD 8350 OEM

Videocard is newer: launch date 9 year(s) 9 month(s) later
2.6x more core clock speed: 650 MHz vs 250 MHz
2.6x more texture fill rate: 5.2 GTexel / s vs 2 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 150 nm
Around 47% lower typical power consumption: 19 Watt vs 28 Watt
16x more maximum memory size: 1 GB vs 64 MB
2.7x more memory clock speed: 1334 MHz vs 500 MHz
Around 36% better performance in PassMark - G2D Mark: 222 vs 163
27.2x better performance in PassMark - G3D Mark: 163 vs 6

Specifications (specs)
Launch date	8 January 2013 vs 1 April 2003
Core clock speed	650 MHz vs 250 MHz
Texture fill rate	5.2 GTexel / s vs 2 GTexel / s
Manufacturing process technology	40 nm vs 150 nm
Thermal Design Power (TDP)	19 Watt vs 28 Watt
Maximum memory size	1 GB vs 64 MB
Memory clock speed	1334 MHz vs 500 MHz
Benchmarks
PassMark - G2D Mark	222 vs 163
PassMark - G3D Mark	163 vs 6

Compare benchmarks

GPU 1: AMD Radeon HD 8350 OEM
GPU 2: ATI Radeon 9100

PassMark - G2D Mark

GPU 1

GPU 2

222

163

PassMark - G3D Mark

GPU 1

GPU 2

163

Name	AMD Radeon HD 8350 OEM	ATI Radeon 9100
PassMark - G2D Mark	222	163
PassMark - G3D Mark	163	6
Geekbench - OpenCL	2883

Compare specifications (specs)

	AMD Radeon HD 8350 OEM	ATI Radeon 9100
Essentials
Architecture	TeraScale 2	Rage 7
Code name	Cedar	R200
Launch date	8 January 2013	1 April 2003
Place in performance rating	1058	1056
Type	Desktop	Desktop
Technical info
Core clock speed	650 MHz	250 MHz
Floating-point performance	104.0 gflops
Manufacturing process technology	40 nm	150 nm
Pipelines	80
Texture fill rate	5.2 GTexel / s	2 GTexel / s
Thermal Design Power (TDP)	19 Watt	28 Watt
Transistor count	292 million	60 million
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	AGP 4x
Length	168 mm
Supplementary power connectors	None	None
API support
DirectX	11.2	8.1
OpenGL	4.4	1.4
Memory
Maximum RAM amount	1 GB	64 MB
Memory bandwidth	10.67 GB / s	8 GB / s
Memory bus width	64 Bit	128 Bit
Memory clock speed	1334 MHz	500 MHz
Memory type	DDR3	DDR