AMD Radeon HD 8530M vs ATI FireMV 2250

Comparative analysis of AMD Radeon HD 8530M and ATI FireMV 2250 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps).

AMD Radeon HD 8530M

ATI FireMV 2250

Differences

Reasons to consider the AMD Radeon HD 8530M

Videocard is newer: launch date 7 year(s) 0 month(s) later
Around 8% higher core clock speed: 650 MHz vs 600 MHz
7x more texture fill rate: 16.8 GTexel / s vs 2.4 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 80 nm
4x more maximum memory size: 1 GB vs 256 MB
Around 80% higher memory clock speed: 1800 MHz vs 1000 MHz
10.7x better performance in PassMark - G3D Mark: 490 vs 46
Around 51% better performance in PassMark - G2D Mark: 438 vs 290

Specifications (specs)
Launch date	10 January 2014 vs 1 January 2007
Core clock speed	650 MHz vs 600 MHz
Texture fill rate	16.8 GTexel / s vs 2.4 GTexel / s
Manufacturing process technology	28 nm vs 80 nm
Maximum memory size	1 GB vs 256 MB
Memory clock speed	1800 MHz vs 1000 MHz
Benchmarks
PassMark - G3D Mark	490 vs 46
PassMark - G2D Mark	438 vs 290

Compare benchmarks

GPU 1: AMD Radeon HD 8530M
GPU 2: ATI FireMV 2250

PassMark - G3D Mark

GPU 1

GPU 2

490

PassMark - G2D Mark

GPU 1

GPU 2

438

290

Name	AMD Radeon HD 8530M	ATI FireMV 2250
PassMark - G3D Mark	490	46
PassMark - G2D Mark	438	290
GFXBench 4.0 - Manhattan (Frames)	2455
GFXBench 4.0 - Manhattan (Fps)	39.6

Compare specifications (specs)

	AMD Radeon HD 8530M	ATI FireMV 2250
Essentials
Architecture	GCN 1.0	R500
Code name	Mars	RV516
Launch date	10 January 2014	1 January 2007
Place in performance rating	598	599
Type	Desktop	Desktop
Technical info
Boost clock speed	700 MHz
Core clock speed	650 MHz	600 MHz
Floating-point performance	537.6 gflops
Manufacturing process technology	28 nm	80 nm
Pipelines	384
Texture fill rate	16.8 GTexel / s	2.4 GTexel / s
Transistor count	1,040 million	107 million
Thermal Design Power (TDP)		32 Watt
Video outputs and ports
Display Connectors	No outputs	1x S-Video, 1x DMS-59
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x8	PCIe 1.0 x16
Length		170 mm
Supplementary power connectors		None
API support
DirectX	12.0 (11_1)	9.0c
OpenGL	4.5	2.0
Memory
Maximum RAM amount	1 GB	256 MB
Memory bandwidth	14.4 GB / s	32.0 GB / s
Memory bus width	64 Bit	256 Bit
Memory clock speed	1800 MHz	1000 MHz
Memory type	DDR3	DDR2