AMD Radeon R7 340 OEM vs ATI FireGL V3300

Comparative analysis of AMD Radeon R7 340 OEM and ATI FireGL V3300 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

AMD Radeon R7 340 OEM

ATI FireGL V3300

Differences

Reasons to consider the AMD Radeon R7 340 OEM

Videocard is newer: launch date 9 year(s) 7 month(s) later
Around 22% higher core clock speed: 730 MHz vs 600 MHz
7.8x more texture fill rate: 18.72 GTexel / s vs 2.4 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 90 nm
16x more maximum memory size: 2 GB vs 128 MB
2.3x more memory clock speed: 1800 MHz vs 800 MHz
Around 10% better performance in PassMark - G2D Mark: 359 vs 326
14.1x better performance in PassMark - G3D Mark: 1000 vs 71

Specifications (specs)
Launch date	5 May 2015 vs 1 October 2005
Core clock speed	730 MHz vs 600 MHz
Texture fill rate	18.72 GTexel / s vs 2.4 GTexel / s
Manufacturing process technology	28 nm vs 90 nm
Maximum memory size	2 GB vs 128 MB
Memory clock speed	1800 MHz vs 800 MHz
Benchmarks
PassMark - G2D Mark	359 vs 326
PassMark - G3D Mark	1000 vs 71

Compare benchmarks

GPU 1: AMD Radeon R7 340 OEM
GPU 2: ATI FireGL V3300

PassMark - G2D Mark

GPU 1

GPU 2

359

326

PassMark - G3D Mark

GPU 1

GPU 2

1000

Name	AMD Radeon R7 340 OEM	ATI FireGL V3300
PassMark - G2D Mark	359	326
PassMark - G3D Mark	1000	71
Geekbench - OpenCL	24076

Compare specifications (specs)

	AMD Radeon R7 340 OEM	ATI FireGL V3300
Essentials
Architecture	GCN 1.0	R500
Code name	Oland	RV515
Launch date	5 May 2015	1 October 2005
Place in performance rating	527	530
Type	Desktop	Workstation
Technical info
Boost clock speed	780 MHz
Core clock speed	730 MHz	600 MHz
Floating-point performance	599.0 gflops
Manufacturing process technology	28 nm	90 nm
Pipelines	384
Texture fill rate	18.72 GTexel / s	2.4 GTexel / s
Thermal Design Power (TDP)	50 Watt
Transistor count	1,040 million	107 million
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI, 1x VGA	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x8	PCIe 1.0 x16
Supplementary power connectors	None	None
API support
DirectX	12.0 (11_1)	9.0c
OpenGL	4.5	2.0
Memory
Maximum RAM amount	2 GB	128 MB
Memory bandwidth	28.8 GB / s	6.4 GB / s
Memory bus width	128 Bit	64 Bit
Memory clock speed	1800 MHz	800 MHz
Memory type	DDR3	DDR2