ATI Mobility Radeon HD 2700 vs ATI Radeon HD 3450

Comparative analysis of ATI Mobility Radeon HD 2700 and ATI Radeon HD 3450 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

ATI Mobility Radeon HD 2700

ATI Radeon HD 3450

Differences

Reasons to consider the ATI Mobility Radeon HD 2700

Around 17% higher core clock speed: 700 MHz vs 600 MHz
2.3x more texture fill rate: 5.6 GTexel / s vs 2.4 GTexel / s
3x more pipelines: 120 vs 40
3.5x better floating-point performance: 168 gflops vs 48 gflops
Around 40% higher memory clock speed: 1400 MHz vs 1000 MHz

Core clock speed	700 MHz vs 600 MHz
Texture fill rate	5.6 GTexel / s vs 2.4 GTexel / s
Pipelines	120 vs 40
Floating-point performance	168 gflops vs 48 gflops
Memory clock speed	1400 MHz vs 1000 MHz

Reasons to consider the ATI Radeon HD 3450

A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 65 nm
Around 40% lower typical power consumption: 25 Watt vs 35 Watt

Manufacturing process technology	55 nm vs 65 nm
Thermal Design Power (TDP)	25 Watt vs 35 Watt

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 2700
GPU 2: ATI Radeon HD 3450

Name	ATI Mobility Radeon HD 2700	ATI Radeon HD 3450
PassMark - G3D Mark		157
PassMark - G2D Mark		25
GFXBench 4.0 - T-Rex (Frames)		735
GFXBench 4.0 - T-Rex (Fps)		735

Compare specifications (specs)

	ATI Mobility Radeon HD 2700	ATI Radeon HD 3450
Essentials
Architecture	TeraScale	TeraScale
Code name	M76	RV620
Launch date	12 December 2007	10 December 2007
Place in performance rating	not rated	1680
Type	Laptop	Desktop
Technical info
Core clock speed	700 MHz	600 MHz
Floating-point performance	168 gflops	48 gflops
Manufacturing process technology	65 nm	55 nm
Pipelines	120	40
Texture fill rate	5.6 GTexel / s	2.4 GTexel / s
Thermal Design Power (TDP)	35 Watt	25 Watt
Transistor count	390 million	181 million
Video outputs and ports
Display Connectors	No outputs	1x DVI, 1x VGA, 1x S-Video
Compatibility, dimensions and requirements
Interface	MXM-II	PCIe 2.0 x16
Laptop size	medium sized
Supplementary power connectors		None
API support
DirectX	10.0	10.1
OpenGL	3.3	3.3
Memory
Maximum RAM amount	256 MB	256 MB
Memory bandwidth	22.4 GB / s	8 GB / s
Memory bus width	128 Bit	64 Bit
Memory clock speed	1400 MHz	1000 MHz
Memory type	DDR2, GDDR3	DDR2
Shared memory	0
Technologies
PowerPlay 7.0