ATI Mobility Radeon HD 2700 vs ATI Radeon HD 2900 PRO

Comparative analysis of ATI Mobility Radeon HD 2700 and ATI Radeon HD 2900 PRO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the ATI Mobility Radeon HD 2700

  • Around 17% higher core clock speed: 700 MHz vs 600 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 80 nm
  • 5.7x lower typical power consumption: 35 Watt vs 200 Watt
Core clock speed 700 MHz vs 600 MHz
Manufacturing process technology 65 nm vs 80 nm
Thermal Design Power (TDP) 35 Watt vs 200 Watt

Reasons to consider the ATI Radeon HD 2900 PRO

  • Around 71% higher texture fill rate: 9.6 GTexel / s vs 5.6 GTexel / s
  • 2.7x more pipelines: 320 vs 120
  • 2.3x better floating-point performance: 384.0 gflops vs 168 gflops
  • 2x more maximum memory size: 512 MB vs 256 MB
  • Around 14% higher memory clock speed: 1600 MHz vs 1400 MHz
Texture fill rate 9.6 GTexel / s vs 5.6 GTexel / s
Pipelines 320 vs 120
Floating-point performance 384.0 gflops vs 168 gflops
Maximum memory size 512 MB vs 256 MB
Memory clock speed 1600 MHz vs 1400 MHz

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 2700
GPU 2: ATI Radeon HD 2900 PRO

Name ATI Mobility Radeon HD 2700 ATI Radeon HD 2900 PRO
PassMark - G3D Mark 628
PassMark - G2D Mark 397

Compare specifications (specs)

ATI Mobility Radeon HD 2700 ATI Radeon HD 2900 PRO

Essentials

Architecture TeraScale TeraScale
Code name M76 R600
Launch date 12 December 2007 12 December 2007
Place in performance rating not rated 382
Type Laptop Desktop

Technical info

Core clock speed 700 MHz 600 MHz
Floating-point performance 168 gflops 384.0 gflops
Manufacturing process technology 65 nm 80 nm
Pipelines 120 320
Texture fill rate 5.6 GTexel / s 9.6 GTexel / s
Thermal Design Power (TDP) 35 Watt 200 Watt
Transistor count 390 million 720 million

Video outputs and ports

Display Connectors No outputs 2x DVI, 1x S-Video

Compatibility, dimensions and requirements

Interface MXM-II PCIe 1.0 x16
Laptop size medium sized
Length 241 mm
Supplementary power connectors 1x 8-pin

API support

DirectX 10.0 10.0
OpenGL 3.3 3.3

Memory

Maximum RAM amount 256 MB 512 MB
Memory bandwidth 22.4 GB / s 118.4 GB / s
Memory bus width 128 Bit 512 Bit
Memory clock speed 1400 MHz 1600 MHz
Memory type DDR2, GDDR3 GDDR4
Shared memory 0

Technologies

PowerPlay 7.0

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