ATI Mobility Radeon HD 2700 vs ATI Radeon HD 2900 PRO

Comparative analysis of ATI Mobility Radeon HD 2700 and ATI Radeon HD 2900 PRO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

ATI Mobility Radeon HD 2700

ATI Radeon HD 2900 PRO

Differences

Reasons to consider the ATI Mobility Radeon HD 2700

Around 17% higher core clock speed: 700 MHz vs 600 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 80 nm
5.7x lower typical power consumption: 35 Watt vs 200 Watt

Core clock speed	700 MHz vs 600 MHz
Manufacturing process technology	65 nm vs 80 nm
Thermal Design Power (TDP)	35 Watt vs 200 Watt

Reasons to consider the ATI Radeon HD 2900 PRO

Around 71% higher texture fill rate: 9.6 GTexel / s vs 5.6 GTexel / s
2.7x more pipelines: 320 vs 120
2.3x better floating-point performance: 384.0 gflops vs 168 gflops
2x more maximum memory size: 512 MB vs 256 MB
Around 14% higher memory clock speed: 1600 MHz vs 1400 MHz

Texture fill rate	9.6 GTexel / s vs 5.6 GTexel / s
Pipelines	320 vs 120
Floating-point performance	384.0 gflops vs 168 gflops
Maximum memory size	512 MB vs 256 MB
Memory clock speed	1600 MHz vs 1400 MHz

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 2700
GPU 2: ATI Radeon HD 2900 PRO

Name	ATI Mobility Radeon HD 2700	ATI Radeon HD 2900 PRO
PassMark - G3D Mark		628
PassMark - G2D Mark		397

Compare specifications (specs)

	ATI Mobility Radeon HD 2700	ATI Radeon HD 2900 PRO
Essentials
Architecture	TeraScale	TeraScale
Code name	M76	R600
Launch date	12 December 2007	12 December 2007
Place in performance rating	not rated	386
Type	Laptop	Desktop
Technical info
Core clock speed	700 MHz	600 MHz
Floating-point performance	168 gflops	384.0 gflops
Manufacturing process technology	65 nm	80 nm
Pipelines	120	320
Texture fill rate	5.6 GTexel / s	9.6 GTexel / s
Thermal Design Power (TDP)	35 Watt	200 Watt
Transistor count	390 million	720 million
Video outputs and ports
Display Connectors	No outputs	2x DVI, 1x S-Video
Compatibility, dimensions and requirements
Interface	MXM-II	PCIe 1.0 x16
Laptop size	medium sized
Length		241 mm
Supplementary power connectors		1x 8-pin
API support
DirectX	10.0	10.0
OpenGL	3.3	3.3
Memory
Maximum RAM amount	256 MB	512 MB
Memory bandwidth	22.4 GB / s	118.4 GB / s
Memory bus width	128 Bit	512 Bit
Memory clock speed	1400 MHz	1600 MHz
Memory type	DDR2, GDDR3	GDDR4
Shared memory	0
Technologies
PowerPlay 7.0