ATI Radeon E4690 vs ATI Mobility FireGL V3200

Comparative analysis of ATI Radeon E4690 and ATI Mobility FireGL V3200 videocards for all known characteristics in the following categories: Essentials, Technical info, Compatibility, dimensions and requirements, API support, Memory, Video outputs and ports, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

ATI Radeon E4690

ATI Mobility FireGL V3200

Differences

Reasons to consider the ATI Radeon E4690

Videocard is newer: launch date 5 year(s) 0 month(s) later
Around 50% higher core clock speed: 600 MHz vs 400 MHz
12x more texture fill rate: 19.2 GTexel / s vs 1.6 GTexel / s
80x more pipelines: 320 vs 4
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 130 nm
4x more maximum memory size: 512 MB vs 128 MB
2.8x more memory clock speed: 1400 MHz vs 500 MHz
6.5x better performance in PassMark - G3D Mark: 405 vs 62
Around 46% better performance in PassMark - G2D Mark: 347 vs 238

Specifications (specs)
Launch date	1 June 2009 vs 1 June 2004
Core clock speed	600 MHz vs 400 MHz
Texture fill rate	19.2 GTexel / s vs 1.6 GTexel / s
Pipelines	320 vs 4
Manufacturing process technology	55 nm vs 130 nm
Maximum memory size	512 MB vs 128 MB
Memory clock speed	1400 MHz vs 500 MHz
Benchmarks
PassMark - G3D Mark	405 vs 62
PassMark - G2D Mark	347 vs 238

Compare benchmarks

GPU 1: ATI Radeon E4690
GPU 2: ATI Mobility FireGL V3200

PassMark - G3D Mark

GPU 1

GPU 2

405

PassMark - G2D Mark

GPU 1

GPU 2

347

238

Name	ATI Radeon E4690	ATI Mobility FireGL V3200
PassMark - G3D Mark	405	62
PassMark - G2D Mark	347	238
GFXBench 4.0 - T-Rex (Frames)	3302
GFXBench 4.0 - T-Rex (Fps)	3302

Compare specifications (specs)

	ATI Radeon E4690	ATI Mobility FireGL V3200
Essentials
Architecture	TeraScale	Rage 9
Code name	RV730	M24
Launch date	1 June 2009	1 June 2004
Place in performance rating	723	725
Type	Desktop	Mobile workstation
Technical info
Core clock speed	600 MHz	400 MHz
Floating-point performance	384.0 gflops
Manufacturing process technology	55 nm	130 nm
Pipelines	320	4
Texture fill rate	19.2 GTexel / s	1.6 GTexel / s
Thermal Design Power (TDP)	30 Watt
Transistor count	514 million	75 million
Boost clock speed		400 MHz
Compatibility, dimensions and requirements
Interface	MXM-II	PCIe 1.0 x16
Laptop size		medium sized
API support
DirectX	10.1	9.0b
OpenGL	3.3	2.0
Memory
Maximum RAM amount	512 MB	128 MB
Memory bandwidth	22.4 GB / s	8 GB / s
Memory bus width	128 Bit
Memory clock speed	1400 MHz	500 MHz
Memory type	GDDR3	128
Shared memory		0
Video outputs and ports
Display Connectors		No outputs
Technologies
PCIe