ATI Radeon HD 2900 GT vs ATI Radeon X550 XT

Comparative analysis of ATI Radeon HD 2900 GT and ATI Radeon X550 XT videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the ATI Radeon HD 2900 GT

  • Videocard is newer: launch date 9 month(s) later
  • Around 50% higher core clock speed: 601 MHz vs 400 MHz
  • 4.5x more texture fill rate: 7.21 GTexel / s vs 1.6 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 80 nm vs 110 nm
  • 2x more maximum memory size: 256 MB vs 128 MB
  • 2.7x more memory clock speed: 1600 MHz vs 600 MHz
  • 5.2x better performance in PassMark - G3D Mark: 292 vs 56
  • Around 54% better performance in PassMark - G2D Mark: 344 vs 224
Specifications (specs)
Launch date 6 November 2007 vs 24 January 2007
Core clock speed 601 MHz vs 400 MHz
Texture fill rate 7.21 GTexel / s vs 1.6 GTexel / s
Manufacturing process technology 80 nm vs 110 nm
Maximum memory size 256 MB vs 128 MB
Memory clock speed 1600 MHz vs 600 MHz
Benchmarks
PassMark - G3D Mark 292 vs 56
PassMark - G2D Mark 344 vs 224

Compare benchmarks

GPU 1: ATI Radeon HD 2900 GT
GPU 2: ATI Radeon X550 XT

PassMark - G3D Mark
GPU 1
GPU 2
292
56
PassMark - G2D Mark
GPU 1
GPU 2
344
224
Name ATI Radeon HD 2900 GT ATI Radeon X550 XT
PassMark - G3D Mark 292 56
PassMark - G2D Mark 344 224
GFXBench 4.0 - T-Rex (Frames) 2648
GFXBench 4.0 - T-Rex (Fps) 2648

Compare specifications (specs)

ATI Radeon HD 2900 GT ATI Radeon X550 XT

Essentials

Architecture TeraScale R400
Code name R600 RV410
Launch date 6 November 2007 24 January 2007
Place in performance rating 779 780
Type Desktop Desktop

Technical info

Core clock speed 601 MHz 400 MHz
Floating-point performance 288.48 gflops
Manufacturing process technology 80 nm 110 nm
Pipelines 240
Texture fill rate 7.21 GTexel / s 1.6 GTexel / s
Thermal Design Power (TDP) 150 Watt
Transistor count 720 million 120 million

Video outputs and ports

Display Connectors 2x DVI, 1x S-Video 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 PCIe 1.0 x16
Supplementary power connectors 1x 8-pin None

API support

DirectX 10.0 9.0b
OpenGL 3.3 2.0

Memory

Maximum RAM amount 256 MB 128 MB
Memory bandwidth 51.2 GB / s 9.6 GB / s
Memory bus width 256 Bit 128 Bit
Memory clock speed 1600 MHz 600 MHz
Memory type GDDR3 GDDR3