NVIDIA GeForce 8800M GTX vs NVIDIA Quadro2 MXR

Comparative analysis of NVIDIA GeForce 8800M GTX and NVIDIA Quadro2 MXR videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA GeForce 8800M GTX

  • Videocard is newer: launch date 7 year(s) 3 month(s) later
  • 2.5x more core clock speed: 500 MHz vs 200 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 180 nm
  • 16x more maximum memory size: 512 MB vs 32 MB
  • 4.4x more memory clock speed: 800 MHz vs 183 MHz
  • 92.4x better performance in PassMark - G3D Mark: 462 vs 5
  • Around 23% better performance in PassMark - G2D Mark: 175 vs 142
Specifications (specs)
Launch date 1 November 2007 vs 25 July 2000
Core clock speed 500 MHz vs 200 MHz
Manufacturing process technology 65 nm vs 180 nm
Maximum memory size 512 MB vs 32 MB
Memory clock speed 800 MHz vs 183 MHz
Benchmarks
PassMark - G3D Mark 462 vs 5
PassMark - G2D Mark 175 vs 142

Reasons to consider the NVIDIA Quadro2 MXR

  • 33.3x more texture fill rate: 800 MTexel / s vs 24 GTexel / s
Texture fill rate 800 MTexel / s vs 24 GTexel / s

Compare benchmarks

GPU 1: NVIDIA GeForce 8800M GTX
GPU 2: NVIDIA Quadro2 MXR

PassMark - G3D Mark
GPU 1
GPU 2
462
5
PassMark - G2D Mark
GPU 1
GPU 2
175
142
Name NVIDIA GeForce 8800M GTX NVIDIA Quadro2 MXR
PassMark - G3D Mark 462 5
PassMark - G2D Mark 175 142
GFXBench 4.0 - T-Rex (Frames) 2485
GFXBench 4.0 - T-Rex (Fps) 2485

Compare specifications (specs)

NVIDIA GeForce 8800M GTX NVIDIA Quadro2 MXR

Essentials

Architecture Tesla Celsius
Code name G92 NV11 B2
Launch date 1 November 2007 25 July 2000
Place in performance rating 1145 1148
Type Laptop Workstation

Technical info

Core clock speed 500 MHz 200 MHz
CUDA cores 96
Floating-point performance 240 gflops
Manufacturing process technology 65 nm 180 nm
Pipelines 96
Texture fill rate 24 GTexel / s 800 MTexel / s
Thermal Design Power (TDP) 65 Watt
Transistor count 754 million 20 million

Video outputs and ports

Display Connectors No outputs 1x VGA

Compatibility, dimensions and requirements

Interface MXM-HE AGP 4x
Laptop size large
Supplementary power connectors None None

API support

DirectX 10.0 7.0
OpenGL 3.3 1.2

Memory

Maximum RAM amount 512 MB 32 MB
Memory bandwidth 51.2 GB / s 2.928 GB / s
Memory bus width 256 Bit 128 Bit
Memory clock speed 800 MHz 183 MHz
Memory type GDDR3 SDR
Shared memory 0

Technologies

Gigathread technology
HDCP-capable
HDR (High Dynamic-Range Lighting)
PCI-E 16x
PowerMizer 7.0
SLI