NVIDIA GeForce G103M vs ATI Radeon VE

Comparative analysis of NVIDIA GeForce G103M and ATI Radeon VE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

NVIDIA GeForce G103M

ATI Radeon VE

Differences

Reasons to consider the NVIDIA GeForce G103M

Videocard is newer: launch date 8 year(s) 6 month(s) later
3.5x more core clock speed: 640 MHz vs 183 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 180 nm
Around 64% lower typical power consumption: 14 Watt vs 23 Watt
16x more maximum memory size: 512 MB vs 32 MB
2.7x more memory clock speed: 1000 MHz vs 366 MHz
31.5x better performance in PassMark - G3D Mark: 63 vs 2

Specifications (specs)
Launch date	1 September 2009 vs 19 February 2001
Core clock speed	640 MHz vs 183 MHz
Manufacturing process technology	65 nm vs 180 nm
Thermal Design Power (TDP)	14 Watt vs 23 Watt
Maximum memory size	512 MB vs 32 MB
Memory clock speed	1000 MHz vs 366 MHz
Benchmarks
PassMark - G3D Mark	63 vs 2

Reasons to consider the ATI Radeon VE

107.2x more texture fill rate: 549 MTexel / s vs 5.12 GTexel / s
Around 6% better performance in PassMark - G2D Mark: 36 vs 34

Specifications (specs)
Texture fill rate	549 MTexel / s vs 5.12 GTexel / s
Benchmarks
PassMark - G2D Mark	36 vs 34

Compare benchmarks

GPU 1: NVIDIA GeForce G103M
GPU 2: ATI Radeon VE

PassMark - G2D Mark

GPU 1

GPU 2

PassMark - G3D Mark

GPU 1

GPU 2

Name	NVIDIA GeForce G103M	ATI Radeon VE
PassMark - G2D Mark	34	36
PassMark - G3D Mark	63	2

Compare specifications (specs)

	NVIDIA GeForce G103M	ATI Radeon VE
Essentials
Architecture	Tesla	Rage 6
Code name	G98	Rage 6
Launch date	1 September 2009	19 February 2001
Place in performance rating	1655	1658
Type	Desktop	Desktop
Technical info
Core clock speed	640 MHz	183 MHz
Floating-point performance	25.6 gflops
Manufacturing process technology	65 nm	180 nm
Pipelines	8
Texture fill rate	5.12 GTexel / s	549 MTexel / s
Thermal Design Power (TDP)	14 Watt	23 Watt
Transistor count	210 million	30 million
Video outputs and ports
Display Connectors	No outputs	1x DVI, 1x VGA, 1x S-Video
Compatibility, dimensions and requirements
Interface	PCIe 1.0 x16	AGP 4x
Supplementary power connectors		None
API support
DirectX	10.0	7.0
OpenGL	3.3	1.3
Memory
Maximum RAM amount	512 MB	32 MB
Memory bandwidth	8 GB / s	2.928 GB / s
Memory bus width	64 Bit	64 Bit
Memory clock speed	1000 MHz	366 MHz
Memory type	DDR2	DDR