NVIDIA GeForce GT 140 OEM vs NVIDIA GeForce FX 5100

Comparative analysis of NVIDIA GeForce GT 140 OEM and NVIDIA GeForce FX 5100 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

NVIDIA GeForce GT 140 OEM

NVIDIA GeForce FX 5100

Differences

Reasons to consider the NVIDIA GeForce GT 140 OEM

Videocard is newer: launch date 6 year(s) 0 month(s) later
3.3x more core clock speed: 650 MHz vs 200 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 150 nm
16x more maximum memory size: 1 GB vs 64 MB
5.4x more memory clock speed: 1800 MHz vs 332 MHz
82.3x better performance in PassMark - G3D Mark: 658 vs 8

Specifications (specs)
Launch date	10 March 2009 vs 6 March 2003
Core clock speed	650 MHz vs 200 MHz
Manufacturing process technology	55 nm vs 150 nm
Maximum memory size	1 GB vs 64 MB
Memory clock speed	1800 MHz vs 332 MHz
Benchmarks
PassMark - G3D Mark	658 vs 8

Reasons to consider the NVIDIA GeForce FX 5100

38.5x more texture fill rate: 800 MTexel / s vs 20.8 GTexel / s
Around 10% better performance in PassMark - G2D Mark: 247 vs 225

Specifications (specs)
Texture fill rate	800 MTexel / s vs 20.8 GTexel / s
Benchmarks
PassMark - G2D Mark	247 vs 225

Compare benchmarks

GPU 1: NVIDIA GeForce GT 140 OEM
GPU 2: NVIDIA GeForce FX 5100

PassMark - G2D Mark

GPU 1

GPU 2

225

247

PassMark - G3D Mark

GPU 1

GPU 2

658

Name	NVIDIA GeForce GT 140 OEM	NVIDIA GeForce FX 5100
PassMark - G2D Mark	225	247
PassMark - G3D Mark	658	8

Compare specifications (specs)

	NVIDIA GeForce GT 140 OEM	NVIDIA GeForce FX 5100
Essentials
Architecture	Tesla	Rankine
Code name	G94B	NV34 A1
Launch date	10 March 2009	6 March 2003
Place in performance rating	699	701
Type	Desktop	Desktop
Technical info
Core clock speed	650 MHz	200 MHz
Floating-point performance	208 gflops
Manufacturing process technology	55 nm	150 nm
Pipelines	64
Texture fill rate	20.8 GTexel / s	800 MTexel / s
Thermal Design Power (TDP)	105 Watt
Transistor count	505 million	45 million
Video outputs and ports
Display Connectors	2x DVI, 1x S-Video	1x VGA, 1x S-Video
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	AGP 8x
Length	229 mm
Supplementary power connectors	1x 6-pin	None
API support
DirectX	10.0	9.0a
OpenGL	3.3	1.5 (2.1)
Memory
Maximum RAM amount	1 GB	64 MB
Memory bandwidth	57.6 GB / s	2.656 GB / s
Memory bus width	256 Bit	64 Bit
Memory clock speed	1800 MHz	332 MHz
Memory type	GDDR3	DDR