NVIDIA H100 CNX vs AMD Radeon RX 6550M

Comparative analysis of NVIDIA H100 CNX and AMD Radeon RX 6550M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

NVIDIA H100 CNX

AMD Radeon RX 6550M

Differences

Reasons to consider the NVIDIA H100 CNX

4.6x more texture fill rate: 841.3 GTexel/s vs 181.8 GTexel/s
14.3x more pipelines: 14592 vs 1024
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 4 nm vs 6 nm
20x more maximum memory size: 80 GB vs 4 GB

Texture fill rate	841.3 GTexel/s vs 181.8 GTexel/s
Pipelines	14592 vs 1024
Manufacturing process technology	4 nm vs 6 nm
Maximum memory size	80 GB vs 4 GB

Reasons to consider the AMD Radeon RX 6550M

Videocard is newer: launch date 9 month(s) later
2.9x more core clock speed: 2000 MHz vs 690 MHz
Around 54% higher boost clock speed: 2840 MHz vs 1845 MHz
4.4x lower typical power consumption: 80 Watt vs 350 Watt
Around 41% higher memory clock speed: 2250 MHz, 18 Gbps effective vs 1593 MHz, 3.2 Gbps effective

Launch date	4 Jan 2023 vs 22 Mar 2022
Core clock speed	2000 MHz vs 690 MHz
Boost clock speed	2840 MHz vs 1845 MHz
Thermal Design Power (TDP)	80 Watt vs 350 Watt
Memory clock speed	2250 MHz, 18 Gbps effective vs 1593 MHz, 3.2 Gbps effective

Compare benchmarks

GPU 1: NVIDIA H100 CNX
GPU 2: AMD Radeon RX 6550M

Name	NVIDIA H100 CNX	AMD Radeon RX 6550M
PassMark - G2D Mark		479
PassMark - G3D Mark		9648
Geekbench - OpenCL		45053

Compare specifications (specs)

	NVIDIA H100 CNX	AMD Radeon RX 6550M
Essentials
Architecture	Hopper	RDNA 2.0
Code name	GH100	Navi 24
Launch date	22 Mar 2022	4 Jan 2023
Place in performance rating	not rated	207
Technical info
Boost clock speed	1845 MHz	2840 MHz
Core clock speed	690 MHz	2000 MHz
Manufacturing process technology	4 nm	6 nm
Pipelines	14592	1024
Pixel fill rate	44.28 GPixel/s	90.88 GPixel/s
Texture fill rate	841.3 GTexel/s	181.8 GTexel/s
Thermal Design Power (TDP)	350 Watt	80 Watt
Transistor count	80000 million	5400 million
Compute units		16
Video outputs and ports
Display Connectors	No outputs	Portable Device Dependent
Compatibility, dimensions and requirements
Form factor	Dual-slot	IGP
Interface	PCIe 5.0 x16	PCIe 4.0 x4
Length	267 mm, 10.5 inches
Recommended system power (PSU)	750 Watt
Supplementary power connectors	8-pin EPS	None
Width	111 mm, 4.4 inches
API support
OpenCL	3.0	2.2
DirectX		12 Ultimate (12_2)
OpenGL		4.6
Shader Model		6.7
Vulkan
Memory
Maximum RAM amount	80 GB	4 GB
Memory bandwidth	2,039 GB/s	144.0 GB/s
Memory bus width	5120 bit	64 bit
Memory clock speed	1593 MHz, 3.2 Gbps effective	2250 MHz, 18 Gbps effective
Memory type	HBM2e	GDDR6