NVIDIA NVS 300 vs NVIDIA GeForce G 103M

Comparative analysis of NVIDIA NVS 300 and NVIDIA GeForce G 103M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA NVS 300

  • Videocard is newer: launch date 1 year(s) 4 month(s) later
  • 2x more pipelines: 16 vs 8
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
  • 3.2x more memory clock speed: 1580 MHz vs 500 MHz
  • Around 7% better performance in GFXBench 4.0 - T-Rex (Frames): 996 vs 934
  • Around 7% better performance in GFXBench 4.0 - T-Rex (Fps): 996 vs 934
Specifications (specs)
Launch date 8 January 2011 vs 1 September 2009
Pipelines 16 vs 8
Manufacturing process technology 40 nm vs 65 nm
Memory clock speed 1580 MHz vs 500 MHz
Benchmarks
GFXBench 4.0 - T-Rex (Frames) 996 vs 934
GFXBench 4.0 - T-Rex (Fps) 996 vs 934

Reasons to consider the NVIDIA GeForce G 103M

  • Around 23% higher core clock speed: 640 MHz vs 520 MHz
Core clock speed 640 MHz vs 520 MHz

Compare benchmarks

GPU 1: NVIDIA NVS 300
GPU 2: NVIDIA GeForce G 103M

GFXBench 4.0 - T-Rex (Frames)
GPU 1
GPU 2
996
934
GFXBench 4.0 - T-Rex (Fps)
GPU 1
GPU 2
996
934
Name NVIDIA NVS 300 NVIDIA GeForce G 103M
PassMark - G3D Mark 121
PassMark - G2D Mark 39
Geekbench - OpenCL 2471
GFXBench 4.0 - T-Rex (Frames) 996 934
GFXBench 4.0 - T-Rex (Fps) 996 934

Compare specifications (specs)

NVIDIA NVS 300 NVIDIA GeForce G 103M

Essentials

Architecture Tesla 2.0 G9x
Code name GT218 G98
Launch date 8 January 2011 1 September 2009
Launch price (MSRP) $109
Place in performance rating 1660 1662
Type Workstation Laptop

Technical info

Core clock speed 520 MHz 640 MHz
Floating-point performance 39.36 gflops
Manufacturing process technology 40 nm 65 nm
Pipelines 16 8
Texture fill rate 4.16 GTexel / s
Thermal Design Power (TDP) 18 Watt
Transistor count 260 million

Video outputs and ports

Display Connectors 1x DMS-59

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16
Length 145 mm
Supplementary power connectors None

API support

DirectX 10.1 10.0
OpenGL 3.3

Memory

Maximum RAM amount 512 MB 512 MB
Memory bandwidth 12.64 GB / s
Memory bus width 64 Bit 64 Bit
Memory clock speed 1580 MHz 500 MHz
Memory type DDR3 DDR2
Shared memory 0