Nom de code de l’architecture |
Gemini Lake |
Broadwell |
Date de sortie |
Q2'19 |
5 January 2015 |
Position dans l’évaluation de la performance |
2264 |
2260 |
Processor Number |
N4000C |
3755U |
Série |
Intel Celeron Processor N Series |
Intel® Celeron® Processor 3000 Series |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Mobile |
Prix de sortie (MSRP) |
|
$107 |
Soutien de 64-bit |
|
|
Base frequency |
1.10 GHz |
1.70 GHz |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
105 °C |
105°C |
Fréquence maximale |
2.60 GHz |
1.7 GHz |
Nombre de noyaux |
2 |
2 |
Nombre de fils |
2 |
2 |
Bus Speed |
|
5 GT/s DMI2 |
Taille de dé |
|
82 mm |
Cache L1 |
|
128 KB |
Cache L2 |
|
512 KB |
Cache L3 |
|
2 MB |
Température maximale de la caisse (TCase) |
|
105 °C |
Compte de transistor |
|
1300 Million |
Réseaux de mémoire maximale |
2 |
2 |
Taille de mémore maximale |
8 GB |
16 GB |
Genres de mémoire soutenus |
DDR4/LPDDR4 up to 2400 MT/s |
DDR3L 1333/1600 LPDDR3 1333/1600 |
Bande passante de mémoire maximale |
|
25.6 GB/s |
Device ID |
0x3185 |
|
Unités d’éxécution |
12 |
|
Graphics base frequency |
200 MHz |
100 MHz |
Freéquency maximale des graphiques |
650 MHz |
800 MHz |
Mémoire de vidéo maximale |
8 GB |
|
Graphiques du processeur |
Intel UHD Graphics 600 |
Intel HD Graphics |
Graphics max dynamic frequency |
|
800 MHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
DisplayPort |
|
|
eDP |
|
|
HDMI |
|
|
MIPI-DSI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien du Wireless Display (WiDi) |
|
|
Soutien de la resolution 4K |
|
|
DirectX |
12 |
11.2/12 |
OpenGL |
4.4 |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
25mm x 24mm |
40mm x 24mm x 1.3mm |
Scenario Design Power (SDP) |
4.8 W |
|
Prise courants soutenu |
FCBGA1090 |
FCBGA1168 |
Thermal Design Power (TDP) |
6 Watt |
15 Watt |
Thermal Solution |
105 °C |
|
Configurable TDP-down |
|
10 W |
Configurable TDP-down Frequency |
|
600 MHz |
Low Halogen Options Available |
|
|
LAN integré |
|
|
Nombre maximale des voies PCIe |
6 |
12 |
Nombre maximale des ports SATA 6 Gb/s |
2 |
|
Nombre des ports USB |
8 |
|
Révision PCI Express |
2.0 |
2.0 |
PCIe configurations |
1x4 + 1x2 or 4x1 or 2x1+1x2 + 1x2 |
4x1 2x4 |
Nombre total des ports SATA |
2 |
|
UART |
|
|
Révision USB |
2.0/3.0 |
|
Technologie Anti-Theft |
|
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
General-Purpose Input/Output (GPIO) |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.2 |
Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Technologie Intel® Smart Response |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|