| Architektur Codename |
Gemini Lake |
Broadwell |
| Startdatum |
Q2'19 |
5 January 2015 |
| Platz in der Leistungsbewertung |
2264 |
2260 |
| Processor Number |
N4000C |
3755U |
| Serie |
Intel Celeron Processor N Series |
Intel® Celeron® Processor 3000 Series |
| Status |
Launched |
Launched |
| Vertikales Segment |
Mobile |
Mobile |
| Einführungspreis (MSRP) |
|
$107 |
| 64-Bit-Unterstützung |
|
|
| Base frequency |
1.10 GHz |
1.70 GHz |
| Fertigungsprozesstechnik |
14 nm |
14 nm |
| Maximale Kerntemperatur |
105 °C |
105°C |
| Maximale Frequenz |
2.60 GHz |
1.7 GHz |
| Anzahl der Adern |
2 |
2 |
| Anzahl der Gewinde |
2 |
2 |
| Bus Speed |
|
5 GT/s DMI2 |
| Matrizengröße |
|
82 mm |
| L1 Cache |
|
128 KB |
| L2 Cache |
|
512 KB |
| L3 Cache |
|
2 MB |
| Maximale Gehäusetemperatur (TCase) |
|
105 °C |
| Anzahl der Transistoren |
|
1300 Million |
| Maximale Speicherkanäle |
2 |
2 |
| Maximale Speichergröße |
8 GB |
16 GB |
| Unterstützte Speichertypen |
DDR4/LPDDR4 up to 2400 MT/s |
DDR3L 1333/1600 LPDDR3 1333/1600 |
| Maximale Speicherbandbreite |
|
25.6 GB/s |
| Device ID |
0x3185 |
|
| Ausführungseinheiten |
12 |
|
| Graphics base frequency |
200 MHz |
100 MHz |
| Grafik Maximalfrequenz |
650 MHz |
800 MHz |
| Maximaler Videospeicher |
8 GB |
|
| Prozessorgrafiken |
Intel UHD Graphics 600 |
Intel HD Graphics |
| Graphics max dynamic frequency |
|
800 MHz |
| Intel® Clear Video HD Technologie |
|
|
| Intel® Clear Video Technologie |
|
|
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| Intel® InTru™ 3D-Technologie |
|
|
| Intel® Quick Sync Video |
|
|
| DisplayPort |
|
|
| eDP |
|
|
| HDMI |
|
|
| MIPI-DSI |
|
|
| Anzahl der unterstützten Anzeigen |
3 |
3 |
| Unterstützung für Wireless Display (WiDi) |
|
|
| Unterstützung von 4K-Auflösungen |
|
|
| DirectX |
12 |
11.2/12 |
| OpenGL |
4.4 |
|
| Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
| Package Size |
25mm x 24mm |
40mm x 24mm x 1.3mm |
| Scenario Design Power (SDP) |
4.8 W |
|
| Unterstützte Sockel |
FCBGA1090 |
FCBGA1168 |
| Thermische Designleistung (TDP) |
6 Watt |
15 Watt |
| Thermal Solution |
105 °C |
|
| Configurable TDP-down |
|
10 W |
| Configurable TDP-down Frequency |
|
600 MHz |
| Low Halogen Options Available |
|
|
| Integriertes LAN |
|
|
| Maximale Anzahl von PCIe-Strecken |
6 |
12 |
| Maximale Anzahl der SATA 6 Gb/s Ports |
2 |
|
| Anzahl der USB-Ports |
8 |
|
| PCI Express Revision |
2.0 |
2.0 |
| PCIe configurations |
1x4 + 1x2 or 4x1 or 2x1+1x2 + 1x2 |
4x1 2x4 |
| Gesamtzahl der SATA-Anschlüsse |
2 |
|
| UART |
|
|
| USB-Überarbeitung |
2.0/3.0 |
|
| Anti-Theft Technologie |
|
|
| Execute Disable Bit (EDB) |
|
|
| Intel® Identity Protection Technologie |
|
|
| Intel® Memory Protection Extensions (Intel® MPX) |
|
|
| Intel® OS Guard |
|
|
| Intel® Secure Key Technologie |
|
|
| Intel® Software Guard Extensions (Intel® SGX) |
|
|
| Intel® Trusted Execution Technologie (TXT) |
|
|
| Enhanced Intel SpeedStep® Technologie |
|
|
| General-Purpose Input/Output (GPIO) |
|
|
| Idle States |
|
|
| Befehlssatzerweiterungen |
Intel SSE4.2 |
Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Intel® Hyper-Threading Technologie |
|
|
| Intel® Optane™ Memory Supported |
|
|
| Intel® Smart Response Technologie |
|
|
| Intel® Turbo Boost Technologie |
|
|
| Intel® vPro™ Platform Eligibility |
|
|
| Speed Shift technology |
|
|
| Thermal Monitoring |
|
|
| Flexible Display interface (FDI) |
|
|
| Intel® Advanced Vector Extensions (AVX) |
|
|
| Intel® Fast Memory Access |
|
|
| Intel® Flex Memory Access |
|
|
| Intel® Stable Image Platform Program (SIPP) |
|
|
| Intel® TSX-NI |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|
| AMD Virtualization (AMD-V™) |
|
|
Intel
