Nom de code de l’architecture |
Haswell |
Sandy Bridge |
Date de sortie |
Q2'14 |
April 2011 |
Position dans l’évaluation de la performance |
1418 |
1412 |
Processor Number |
E3-1271V3 |
E3-1275 |
Série |
Intel® Xeon® Processor E3 v3 Family |
Intel® Xeon® Processor E3 Family |
Status |
Launched |
Discontinued |
Segment vertical |
Server |
Server |
Prix de sortie (MSRP) |
|
$450 |
Prix maintenant |
|
$304 |
Valeur pour le prix (0-100) |
|
8.09 |
Soutien de 64-bit |
|
|
Base frequency |
3.60 GHz |
3.40 GHz |
Bus Speed |
5 GT/s DMI2 |
5 GT/s DMI |
Processus de fabrication |
22 nm |
32 nm |
Fréquence maximale |
4.00 GHz |
3.80 GHz |
Nombre de noyaux |
4 |
4 |
Number of QPI Links |
0 |
|
Nombre de fils |
8 |
8 |
Taille de dé |
|
216 mm |
Cache L1 |
|
64 KB (per core) |
Cache L2 |
|
256 KB (per core) |
Cache L3 |
|
8192 KB (shared) |
Température de noyau maximale |
|
72.6°C |
Compte de transistor |
|
1160 million |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
25.6 GB/s |
21 GB/s |
Taille de mémore maximale |
32 GB |
32 GB |
Genres de mémoire soutenus |
DDR3 and DDR3L 1333/1600 at 1.5V |
DDR3 1066/1333 |
Soutien de la mémoire ECC |
|
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
37.5mm x 37.5mm |
37.5mm x 37.5mm |
Prise courants soutenu |
FCLGA1150 |
LGA1155 |
Thermal Design Power (TDP) |
80 Watt |
95 Watt |
Thermal Solution |
PCG 2013D |
|
Nombre maximale des voies PCIe |
16 |
20 |
Révision PCI Express |
3.0 |
2.0 |
PCIe configurations |
1x16, 2x8, 1x8/2x4 |
|
Scalability |
1S Only |
|
Technologie Anti-Theft |
|
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Graphics base frequency |
|
850 MHz |
Graphics max dynamic frequency |
|
1.35 GHz |
Freéquency maximale des graphiques |
|
1.35 GHz |
Technologie Intel® Clear Video HD |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
|
Intel HD Graphics P3000 |
Nombre d’écrans soutenu |
|
2 |
Soutien du Wireless Display (WiDi) |
|
|