Architektur Codename |
Broadwell |
Broadwell |
Startdatum |
6 January 2015 |
5 January 2015 |
Einführungspreis (MSRP) |
$315 |
$107 |
Platz in der Leistungsbewertung |
2248 |
2260 |
Processor Number |
i3-5157U |
3755U |
Serie |
5th Generation Intel® Core™ i3 Processors |
Intel® Celeron® Processor 3000 Series |
Status |
Launched |
Launched |
Vertikales Segment |
Mobile |
Mobile |
64-Bit-Unterstützung |
|
|
Base frequency |
2.50 GHz |
1.70 GHz |
Bus Speed |
5 GT/s DMI2 |
5 GT/s DMI2 |
Matrizengröße |
133 mm |
82 mm |
L1 Cache |
128 KB |
128 KB |
L2 Cache |
512 KB |
512 KB |
L3 Cache |
3 MB |
2 MB |
Fertigungsprozesstechnik |
14 nm |
14 nm |
Maximale Gehäusetemperatur (TCase) |
105 °C |
105 °C |
Maximale Kerntemperatur |
105°C |
105°C |
Maximale Frequenz |
2.5 GHz |
1.7 GHz |
Anzahl der Adern |
2 |
2 |
Anzahl der Gewinde |
4 |
2 |
Anzahl der Transistoren |
1900 Million |
1300 Million |
Maximale Speicherkanäle |
2 |
2 |
Maximale Speicherbandbreite |
25.6 GB/s |
25.6 GB/s |
Maximale Speichergröße |
16 GB |
16 GB |
Unterstützte Speichertypen |
DDR3L 1333/1600, LPDDR3 1600/1866 |
DDR3L 1333/1600 LPDDR3 1333/1600 |
Device ID |
0x162B |
|
Graphics base frequency |
300 MHz |
100 MHz |
Graphics max dynamic frequency |
1.00 GHz |
800 MHz |
Grafik Maximalfrequenz |
1 GHz |
800 MHz |
Intel® Clear Video HD Technologie |
|
|
Intel® Clear Video Technologie |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® InTru™ 3D-Technologie |
|
|
Intel® Quick Sync Video |
|
|
Maximaler Videospeicher |
16 GB |
|
Prozessorgrafiken |
Intel® Iris® Graphics 6100 |
Intel HD Graphics |
DisplayPort |
|
|
eDP |
|
|
HDMI |
|
|
Anzahl der unterstützten Anzeigen |
3 |
3 |
Unterstützung für Wireless Display (WiDi) |
|
|
Maximale Auflösung über DisplayPort |
3840x2160@60Hz |
|
Maximale Auflösung über HDMI 1.4 |
2560x1600@60Hz |
|
Maximale Auflösung über VGA |
N / A |
|
DirectX |
11.2/12 |
11.2/12 |
OpenGL |
4.3 |
|
Configurable TDP-down |
23 W |
10 W |
Configurable TDP-down Frequency |
600 MHz |
600 MHz |
Low Halogen Options Available |
|
|
Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
Package Size |
40mm x24mm x 1.3mm |
40mm x 24mm x 1.3mm |
Unterstützte Sockel |
FCBGA1168 |
FCBGA1168 |
Thermische Designleistung (TDP) |
28 Watt |
15 Watt |
Maximale Anzahl von PCIe-Strecken |
12 |
12 |
PCI Express Revision |
2.0 |
2.0 |
PCIe configurations |
4x1, 2x4 |
4x1 2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® Identity Protection Technologie |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
Flexible Display interface (FDI) |
|
|
Idle States |
|
|
Befehlssatzerweiterungen |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® AES New Instructions |
|
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Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
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Intel® Hyper-Threading Technologie |
|
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Intel® Smart Response Technologie |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® Turbo Boost Technologie |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
AMD Virtualization (AMD-V™) |
|
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Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
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Intel® VT-x with Extended Page Tables (EPT) |
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