Nom de code de l’architecture |
Broadwell |
Broadwell |
Date de sortie |
6 January 2015 |
5 January 2015 |
Prix de sortie (MSRP) |
$315 |
$107 |
Position dans l’évaluation de la performance |
2248 |
2260 |
Processor Number |
i3-5157U |
3755U |
Série |
5th Generation Intel® Core™ i3 Processors |
Intel® Celeron® Processor 3000 Series |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Mobile |
Soutien de 64-bit |
|
|
Base frequency |
2.50 GHz |
1.70 GHz |
Bus Speed |
5 GT/s DMI2 |
5 GT/s DMI2 |
Taille de dé |
133 mm |
82 mm |
Cache L1 |
128 KB |
128 KB |
Cache L2 |
512 KB |
512 KB |
Cache L3 |
3 MB |
2 MB |
Processus de fabrication |
14 nm |
14 nm |
Température maximale de la caisse (TCase) |
105 °C |
105 °C |
Température de noyau maximale |
105°C |
105°C |
Fréquence maximale |
2.5 GHz |
1.7 GHz |
Nombre de noyaux |
2 |
2 |
Nombre de fils |
4 |
2 |
Compte de transistor |
1900 Million |
1300 Million |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
25.6 GB/s |
25.6 GB/s |
Taille de mémore maximale |
16 GB |
16 GB |
Genres de mémoire soutenus |
DDR3L 1333/1600, LPDDR3 1600/1866 |
DDR3L 1333/1600 LPDDR3 1333/1600 |
Device ID |
0x162B |
|
Graphics base frequency |
300 MHz |
100 MHz |
Graphics max dynamic frequency |
1.00 GHz |
800 MHz |
Freéquency maximale des graphiques |
1 GHz |
800 MHz |
Technologie Intel® Clear Video HD |
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|
Technologie Intel® Clear Video |
|
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Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
16 GB |
|
Graphiques du processeur |
Intel® Iris® Graphics 6100 |
Intel HD Graphics |
DisplayPort |
|
|
eDP |
|
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HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien du Wireless Display (WiDi) |
|
|
Résolution maximale sur DisplayPort |
3840x2160@60Hz |
|
Résolution maximale sur HDMI 1.4 |
2560x1600@60Hz |
|
Résolution maximale sur VGA |
N / A |
|
DirectX |
11.2/12 |
11.2/12 |
OpenGL |
4.3 |
|
Configurable TDP-down |
23 W |
10 W |
Configurable TDP-down Frequency |
600 MHz |
600 MHz |
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
40mm x24mm x 1.3mm |
40mm x 24mm x 1.3mm |
Prise courants soutenu |
FCBGA1168 |
FCBGA1168 |
Thermal Design Power (TDP) |
28 Watt |
15 Watt |
Nombre maximale des voies PCIe |
12 |
12 |
Révision PCI Express |
2.0 |
2.0 |
PCIe configurations |
4x1, 2x4 |
4x1 2x4 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
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Intel® OS Guard |
|
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Technologie Intel® Secure Key |
|
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Technologie Intel® Trusted Execution (TXT) |
|
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Technologie Enhanced Intel SpeedStep® |
|
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Flexible Display interface (FDI) |
|
|
Idle States |
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Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 |
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Intel® Advanced Vector Extensions (AVX) |
|
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Intel® AES New Instructions |
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Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
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Technologie Intel® Hyper-Threading |
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Technologie Intel® Smart Response |
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Intel® Stable Image Platform Program (SIPP) |
|
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Intel® TSX-NI |
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Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
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Thermal Monitoring |
|
|
AMD Virtualization (AMD-V™) |
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Intel® Virtualization Technology (VT-x) |
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Intel® Virtualization Technology for Directed I/O (VT-d) |
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Intel® VT-x with Extended Page Tables (EPT) |
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