Architektur Codename |
Hewitt Lake |
Sandy Bridge |
Startdatum |
2 Apr 2019 |
April 2011 |
Einführungspreis (MSRP) |
$106 |
|
Platz in der Leistungsbewertung |
1664 |
1526 |
Processor Number |
D-1602 |
E3-1220L |
Serie |
Intel Xeon D Processor |
Intel® Xeon® Processor E3 Family |
Status |
Launched |
Discontinued |
Vertikales Segment |
Server |
Server |
64-Bit-Unterstützung |
|
|
Base frequency |
2.50 GHz |
2.20 GHz |
L1 Cache |
128 KB |
64 KB (per core) |
L2 Cache |
512 KB |
256 KB (per core) |
L3 Cache |
3 MB |
3072 KB (shared) |
Fertigungsprozesstechnik |
14 nm |
32 nm |
Maximale Kerntemperatur |
84 |
77.5°C |
Maximale Frequenz |
3.20 GHz |
3.40 GHz |
Anzahl der Adern |
2 |
2 |
Number of QPI Links |
0 |
|
Anzahl der Gewinde |
4 |
4 |
Number of Ultra Path Interconnect (UPI) Links |
0 |
|
Bus Speed |
|
5 GT/s DMI |
Matrizengröße |
|
131 mm |
Anzahl der Transistoren |
|
504 million |
Maximale Speicherkanäle |
2 |
2 |
Maximale Speichergröße |
128 GB |
32 GB |
Supported memory frequency |
2133 MHz |
|
Unterstützte Speichertypen |
DDR4, DDR3 |
DDR3 1066/1333 |
ECC-Speicherunterstützung |
|
|
Maximale Speicherbandbreite |
|
21 GB/s |
Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
Package Size |
37.5mm x 37.5mm |
37.5mm x 37.5mm |
Unterstützte Sockel |
FCBGA1667 |
FCLGA1155 |
Thermische Designleistung (TDP) |
27 Watt |
20 Watt |
Low Halogen Options Available |
|
|
Integriertes LAN |
|
|
Maximale Anzahl von PCIe-Strecken |
32 |
20 |
Maximale Anzahl der SATA 6 Gb/s Ports |
6 |
|
Anzahl der USB-Ports |
8 |
|
PCI Express Revision |
2.0/3.0 |
2.0 |
PCIe configurations |
x4 x8 x16 |
|
Scalability |
1S Only |
|
Gesamtzahl der SATA-Anschlüsse |
6 |
|
UART |
|
|
USB-Überarbeitung |
2.0/3.0 |
|
Execute Disable Bit (EDB) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Secure Boot |
|
|
Intel® Identity Protection Technologie |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
General-Purpose Input/Output (GPIO) |
|
|
Idle States |
|
|
Befehlssatzerweiterungen |
Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Integrated Intel® QuickAssist Technology |
|
|
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Hyper-Threading Technologie |
|
|
Intel® ME Firmware Version |
SPS 3.0 |
|
Intel® Optane™ Memory Supported |
|
|
Intel® Turbo Boost Technologie |
|
|
Quiet System |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Intel® Clear Video HD Technologie |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® InTru™ 3D-Technologie |
|
|
Intel® Quick Sync Video |
|
|
Unterstützung für Wireless Display (WiDi) |
|
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