AMD Ryzen 3 3250U processor review
Ryzen 3 3250U processor released by AMD; release date: 6 Jan 2020. The processor is designed for laptop-computers and based on Zen microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 3.5 GHz. Maximum operating temperature - 95 °C. Manufacturing process technology - 14 nm. Cache size: L1 - 192 KB, L2 - 1 MB, L3 - 4 MB.
Supported memory types: DDR4-2400. Maximum memory size: 32 GB.
Supported socket types: FP5. Power consumption (TDP): 15 Watt.
The processor has integrated graphics Radeon Vega 3.
Benchmarks
PassMark Single thread mark |
|
|
||||
PassMark CPU mark |
|
|
Name | Value |
---|---|
PassMark - Single thread mark | 1772 |
PassMark - CPU mark | 3805 |
Integrated graphics – AMD Radeon Vega 3
Technical info |
|
Boost clock speed | 1000 MHz |
Core clock speed | 300 MHz |
Floating-point performance | 384.0 gflops |
Manufacturing process technology | 14 nm |
Pipelines | 192 |
Texture fill rate | 12 GTexel / s |
Thermal Design Power (TDP) | 15 Watt |
Transistor count | 4,940 million |
Specifications (specs)
Essentials |
|
Architecture codename | Zen |
Family | AMD Ryzen |
Launch date | 6 Jan 2020 |
OPN Tray | YM3250C4T2OFG |
Place in performance rating | 1454 |
Series | AMD Ryzen 3 Mobile Processors with Radeon Graphics |
Vertical segment | Laptop |
Performance |
|
Base frequency | 2.6 GHz |
L1 cache | 192 KB |
L2 cache | 1 MB |
L3 cache | 4 MB |
Manufacturing process technology | 14 nm |
Maximum core temperature | 95 °C |
Maximum frequency | 3.5 GHz |
Number of cores | 2 |
Number of GPU cores | 3 |
Number of threads | 4 |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 35.76 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR4-2400 |
Graphics |
|
Execution Units | 3 |
Graphics base frequency | 1200 MHz |
Number of pipelines | 192 |
Processor graphics | Radeon Vega 3 |
Graphics interfaces |
|
DisplayPort | |
HDMI | |
Graphics API support |
|
DirectX | 12 |
OpenGL | 4.6 |
Vulkan | |
Compatibility |
|
Configurable TDP | 12-25 Watt |
Sockets supported | FP5 |
Thermal Design Power (TDP) | 15 Watt |
Peripherals |
|
Max number of PCIe lanes | 12 |
PCI Express revision | 3.0 |
PCIe configurations | 1x8+1x4 |