Intel Xeon E-2276ME vs AMD Ryzen 3 3250U
Comparative analysis of Intel Xeon E-2276ME and AMD Ryzen 3 3250U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E-2276ME
- 4 more cores, run more applications at once: 6 vs 2
- 8 more threads: 12 vs 4
- Around 29% higher clock speed: 4.50 GHz vs 3.5 GHz
- Around 5% higher maximum core temperature: 100 vs 95 °C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 64 GB vs 32 GB
- 2.1x better performance in PassMark - CPU mark: 8167 vs 3809
Specifications (specs) | |
Number of cores | 6 vs 2 |
Number of threads | 12 vs 4 |
Maximum frequency | 4.50 GHz vs 3.5 GHz |
Maximum core temperature | 100 vs 95 °C |
L1 cache | 384 KB vs 192 KB |
L2 cache | 1.5 MB vs 1 MB |
L3 cache | 12 MB vs 4 MB |
Maximum memory size | 64 GB vs 32 GB |
Benchmarks | |
PassMark - CPU mark | 8167 vs 3809 |
Reasons to consider the AMD Ryzen 3 3250U
- CPU is newer: launch date 7 month(s) later
- 3x lower typical power consumption: 15 Watt vs 45 Watt
- Around 10% better performance in PassMark - Single thread mark: 1772 vs 1604
Specifications (specs) | |
Launch date | 6 Jan 2020 vs 27 May 2019 |
Thermal Design Power (TDP) | 15 Watt vs 45 Watt |
Benchmarks | |
PassMark - Single thread mark | 1772 vs 1604 |
Compare benchmarks
CPU 1: Intel Xeon E-2276ME
CPU 2: AMD Ryzen 3 3250U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E-2276ME | AMD Ryzen 3 3250U |
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PassMark - Single thread mark | 1604 | 1772 |
PassMark - CPU mark | 8167 | 3809 |
Compare specifications (specs)
Intel Xeon E-2276ME | AMD Ryzen 3 3250U | |
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Essentials |
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Architecture codename | Coffee Lake | Zen |
Launch date | 27 May 2019 | 6 Jan 2020 |
Launch price (MSRP) | $450 | |
Place in performance rating | 1469 | 1453 |
Processor Number | E-2276ME | |
Series | Intel Xeon E Processor | AMD Ryzen 3 Mobile Processors with Radeon Graphics |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Family | AMD Ryzen | |
OPN Tray | YM3250C4T2OFG | |
Performance |
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64 bit support | ||
Base frequency | 2.80 GHz | 2.6 GHz |
Bus Speed | 8 GT/s | |
L1 cache | 384 KB | 192 KB |
L2 cache | 1.5 MB | 1 MB |
L3 cache | 12 MB | 4 MB |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 100 | 95 °C |
Maximum frequency | 4.50 GHz | 3.5 GHz |
Number of cores | 6 | 2 |
Number of threads | 12 | 4 |
Number of GPU cores | 3 | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory size | 64 GB | 32 GB |
Supported memory types | DDR4-2666 | DDR4-2400 |
Maximum memory bandwidth | 35.76 GB/s | |
Graphics |
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Device ID | 0x3E94 | |
Graphics base frequency | 350 MHz | 1200 MHz |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P630 | Radeon Vega 3 |
Execution Units | 3 | |
Number of pipelines | 192 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@30Hz | |
Max resolution over eDP | 4096x2304@30Hz | |
Graphics API support |
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DirectX | 12 | 12 |
OpenGL | 4.5 | 4.6 |
Vulkan | ||
Compatibility |
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Configurable TDP-down | 35 Watt | |
Max number of CPUs in a configuration | 1 | |
Package Size | 42mm x 28mm | |
Sockets supported | FCBGA1440 | FP5 |
Thermal Design Power (TDP) | 45 Watt | 15 Watt |
Configurable TDP | 12-25 Watt | |
Peripherals |
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Max number of PCIe lanes | 16 | 12 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x8+1x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |