Intel Core i3-9100TE vs AMD Ryzen 3 3250U
Comparative analysis of Intel Core i3-9100TE and AMD Ryzen 3 3250U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-9100TE
- 2 more cores, run more applications at once: 4 vs 2
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 16% better performance in PassMark - CPU mark: 4382 vs 3766
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Maximum core temperature | 100°C vs 95 °C |
| L1 cache | 256 KB vs 192 KB |
| L3 cache | 6 MB vs 4 MB |
| Maximum memory size | 64 GB vs 32 GB |
| Benchmarks | |
| PassMark - CPU mark | 4382 vs 3766 |
Reasons to consider the AMD Ryzen 3 3250U
- Around 9% higher clock speed: 3.5 GHz vs 3.20 GHz
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 3% better performance in PassMark - Single thread mark: 1749 vs 1690
| Specifications (specs) | |
| Maximum frequency | 3.5 GHz vs 3.20 GHz |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1749 vs 1690 |
Compare benchmarks
CPU 1: Intel Core i3-9100TE
CPU 2: AMD Ryzen 3 3250U
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-9100TE | AMD Ryzen 3 3250U |
|---|---|---|
| PassMark - Single thread mark | 1690 | 1749 |
| PassMark - CPU mark | 4382 | 3766 |
Compare specifications (specs)
| Intel Core i3-9100TE | AMD Ryzen 3 3250U | |
|---|---|---|
Essentials |
||
| Architecture codename | Coffee Lake | Zen |
| Launch date | Q2'19 | 6 Jan 2020 |
| Launch price (MSRP) | $122 | |
| Place in performance rating | 1507 | 1472 |
| Processor Number | i3-9100TE | |
| Series | 9th Generation Intel Core i3 Processors | AMD Ryzen 3 Mobile Processors with Radeon Graphics |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
| Family | AMD Ryzen | |
| OPN Tray | YM3250C4T2OFG | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.20 GHz | 2.6 GHz |
| Bus Speed | 8 GT/s | |
| L1 cache | 256 KB | 192 KB |
| L2 cache | 1 MB | 1 MB |
| L3 cache | 6 MB | 4 MB |
| Manufacturing process technology | 14 nm | 14 nm |
| Maximum core temperature | 100°C | 95 °C |
| Maximum frequency | 3.20 GHz | 3.5 GHz |
| Number of cores | 4 | 2 |
| Number of threads | 4 | 4 |
| Number of GPU cores | 3 | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 37.5 GB/s | 35.76 GB/s |
| Maximum memory size | 64 GB | 32 GB |
| Supported memory types | DDR-2400 | DDR4-2400 |
Graphics |
||
| Device ID | 0x3E98 | |
| Graphics base frequency | 350 MHz | 1200 MHz |
| Graphics max dynamic frequency | 1.05 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics 630 | Radeon Vega 3 |
| Execution Units | 3 | |
| Number of pipelines | 192 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096 x 2304@60Hz | |
| Max resolution over eDP | 4096 x 2304@60Hz | |
Graphics API support |
||
| DirectX | 12 | 12 |
| OpenGL | 4.5 | 4.6 |
| Vulkan | ||
Compatibility |
||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1151 | FP5 |
| Thermal Design Power (TDP) | 35 Watt | 15 Watt |
| Configurable TDP | 12-25 Watt | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 12 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x8+1x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||