AMD Sempron 2650 processor review

AMD Sempron 2650

Sempron 2650 processor released by AMD. The processor is designed for desktop-computers.

CPU is unlocked for overclocking. Total number of cores - 2, threads - 2. Maximum operating temperature - 90°C. Manufacturing process technology - 28 nm. Cache size: L1 - 128 KB, L2 - 1 MB.

Supported socket types: AM1. Power consumption (TDP): 25 Watt.

The processor has integrated graphics AMD Radeon R3 Graphics with the following parameters: maximum frequency - 400 MHz, cores count - 128.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
477
PassMark
CPU mark
Top 1 CPU
This CPU
156834
551
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
151
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
253
CompuBench 1.5 Desktop
Face Detection
Top 1 CPU
This CPU
97.640 mPixels/s
3.724 mPixels/s
CompuBench 1.5 Desktop
Ocean Surface Simulation
Top 1 CPU
This CPU
741.453 Frames/s
84.309 Frames/s
CompuBench 1.5 Desktop
T-Rex
Top 1 CPU
This CPU
4.623 Frames/s
0.310 Frames/s
CompuBench 1.5 Desktop
Video Composition
Top 1 CPU
This CPU
49.002 Frames/s
5.299 Frames/s
CompuBench 1.5 Desktop
Bitcoin Mining
Top 1 CPU
This CPU
218.231 mHash/s
13.811 mHash/s
Name Value
PassMark - Single thread mark 477
PassMark - CPU mark 551
Geekbench 4 - Single Core 151
Geekbench 4 - Multi-Core 253
CompuBench 1.5 Desktop - Face Detection 3.724 mPixels/s
CompuBench 1.5 Desktop - Ocean Surface Simulation 84.309 Frames/s
CompuBench 1.5 Desktop - T-Rex 0.310 Frames/s
CompuBench 1.5 Desktop - Video Composition 5.299 Frames/s
CompuBench 1.5 Desktop - Bitcoin Mining 13.811 mHash/s

Integrated graphics – AMD Radeon R3 Graphics

Technical info

Boost clock speed 600 MHz
Core clock speed 267 MHz
Floating-point performance 153.6 gflops
Manufacturing process technology 28 nm
Pipelines 128
Texture fill rate 4.8 GTexel / s
Thermal Design Power (TDP) 15 Watt
Transistor count 930 million

Specifications (specs)

Essentials

Family AMD Sempron
OPN PIB SD2650JAHMBOX
OPN Tray SD2650JAH23HM
Place in performance rating 2887
Series AMD Sempron Dual-Core APU
Vertical segment Desktop

Performance

Base frequency 1.45 GHz
L1 cache 128 KB
L2 cache 1 MB
Manufacturing process technology 28 nm
Maximum core temperature 90°C
Number of cores 2
Number of threads 2
Unlocked

Memory

Max memory channels 1
Supported memory frequency 1333 MHz

Graphics

Enduro
Graphics max frequency 400 MHz
iGPU core count 128
Processor graphics AMD Radeon R3 Graphics
Switchable graphics
Unified Video Decoder (UVD)
Video Codec Engine (VCE)

Graphics interfaces

DisplayPort
HDMI

Graphics API support

DirectX 12
Vulkan

Compatibility

Sockets supported AM1
Thermal Design Power (TDP) 25 Watt

Advanced Technologies

AMD App Acceleration
AMD Elite Experiences
AMD HD3D technology
Enhanced Virus Protection (EVP)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
PowerGating
PowerNow

Virtualization

AMD Virtualization (AMD-V™)
IOMMU 2.0