Intel Celeron N2808 processor review
Celeron N2808 processor released by Intel; release date: 22 May 2014. The processor is designed for mobile-computers and based on Bay Trail microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.25 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 22 nm. Cache size: L1 - 112 KB, L2 - 1 MB.
Supported memory types: DDR3L 1333. Maximum memory size: 4 GB.
Supported socket types: FCBGA1170. Maximum number of processors in a configuration - 1. Power consumption (TDP): 4.5 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 792 MHz.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Name | Value |
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PassMark - Single thread mark | 586 |
PassMark - CPU mark | 510 |
Specifications (specs)
Essentials |
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Architecture codename | Bay Trail |
Launch date | 22 May 2014 |
Place in performance rating | 2843 |
Processor Number | N2808 |
Series | Intel® Celeron® Processor N Series |
Status | Launched |
Vertical segment | Mobile |
Performance |
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64 bit support | |
Base frequency | 1.58 GHz |
L1 cache | 112 KB |
L2 cache | 1 MB |
Manufacturing process technology | 22 nm |
Maximum core temperature | 100°C |
Maximum frequency | 2.25 GHz |
Number of cores | 2 |
Number of threads | 2 |
Memory |
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Max memory channels | 1 |
Maximum memory bandwidth | 10.66 GB/s |
Maximum memory size | 4 GB |
Supported memory types | DDR3L 1333 |
Graphics |
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Graphics base frequency | 311 MHz |
Graphics max dynamic frequency | 792 MHz |
Graphics max frequency | 792 MHz |
Intel® Clear Video HD technology | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
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Number of displays supported | 2 |
Wireless Display (WiDi) support | |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 25mm x 27mm |
Scenario Design Power (SDP) | 3 W |
Sockets supported | FCBGA1170 |
Thermal Design Power (TDP) | 4.5 Watt |
Peripherals |
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Max number of PCIe lanes | 4 |
Number of USB ports | 5 |
PCI Express revision | 2.0 |
PCIe configurations | 1x4 |
Total number of SATA ports | 2 |
USB revision | 3.0 and 2.0 |
Security & Reliability |
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Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Secure Key technology | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Smart Connect | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) |