Intel Core 2 Duo T8100 processor review
Core 2 Duo T8100 processor released by Intel; release date: 10 January 2008. At the time of release, the processor cost $209. The processor is designed for mobile-computers and based on Penryn microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.1 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 45 nm. Cache size: L2 - 3072 KB.
Supported socket types: PGA478, BGA479. Power consumption (TDP): 35 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 833 |
| PassMark - CPU mark | 770 |
| Geekbench 4 - Single Core | 295 |
| Geekbench 4 - Multi-Core | 512 |
| CompuBench 1.5 Desktop - Face Detection | 0.230 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 15.035 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.075 Frames/s |
Specifications (specs)
Essentials |
|
| Architecture codename | Penryn |
| Launch date | 10 January 2008 |
| Launch price (MSRP) | $209 |
| Place in performance rating | 3158 |
| Price now | $999.99 |
| Processor Number | T8100 |
| Series | Legacy Intel® Core™ Processors |
| Status | Discontinued |
| Value for money (0-100) | 0.38 |
| Vertical segment | Mobile |
Performance |
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| 64 bit support | |
| Base frequency | 2.10 GHz |
| Bus Speed | 800 MHz FSB |
| Die size | 107 mm2 |
| Front-side bus (FSB) | 800 MHz |
| L2 cache | 3072 KB |
| Manufacturing process technology | 45 nm |
| Maximum core temperature | 105°C |
| Maximum frequency | 2.1 GHz |
| Number of cores | 2 |
| Number of threads | 2 |
| Transistor count | 410 million |
| VID voltage range | 1.000V-1.250V |
Compatibility |
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| Low Halogen Options Available | |
| Package Size | 35mm x 35mm |
| Sockets supported | PGA478, BGA479 |
| Thermal Design Power (TDP) | 35 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| FSB parity | |
| Idle States | |
| Intel 64 | |
| Intel® Demand Based Switching | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
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