Intel Xeon E3-1290 processor review

Xeon E3-1290 processor released by Intel; release date: May 2011. At the time of release, the processor cost $885. The processor is designed for server-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.00 GHz. Maximum operating temperature - 56.7°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).

Supported memory types: DDR3 1066/1333. Maximum memory size: 32 GB.

Supported socket types: LGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 95 Watt.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4760

1834

PassMark
CPU mark

Top 1 CPU

This CPU

154674

5429

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

725

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

2794

Name	Value
PassMark - Single thread mark	1834
PassMark - CPU mark	5429
Geekbench 4 - Single Core	725
Geekbench 4 - Multi-Core	2794

Specifications (specs)

Essentials
Architecture codename	Sandy Bridge
Launch date	May 2011
Launch price (MSRP)	$885
Place in performance rating	1682
Price now	$885
Processor Number	E3-1290
Series	Intel® Xeon® Processor E3 Family
Status	Discontinued
Value for money (0-100)	2.89
Vertical segment	Server
Performance
64 bit support
Base frequency	3.60 GHz
Bus Speed	5 GT/s DMI
Die size	216 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	8192 KB (shared)
Manufacturing process technology	32 nm
Maximum core temperature	56.7°C
Maximum frequency	4.00 GHz
Number of cores	4
Number of threads	8
Transistor count	1160 million

Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1066/1333
Graphics
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	LGA1155
Thermal Design Power (TDP)	95 Watt
Peripherals
Max number of PCIe lanes	20
PCI Express revision	2.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)