Intel Xeon E5-2470 v2 processor review
Xeon E5-2470 v2 processor released by Intel; release date: September 2013. The processor is designed for server-computers and based on Ivy Bridge EN microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 10, threads - 20. Maximum CPU clock speed - 3.20 GHz. Maximum operating temperature - 80°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 25600 KB (shared).
Supported memory types: DDR3 800/1066/1333/1600. Maximum memory size: 384 GB.
Supported socket types: FCLGA1356. Maximum number of processors in a configuration - 2. Power consumption (TDP): 95 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1555 |
| PassMark - CPU mark | 19022 |
| Geekbench 4 - Single Core | 2913 |
| Geekbench 4 - Multi-Core | 21273 |
Specifications (specs)
Essentials |
|
| Architecture codename | Ivy Bridge EN |
| Launch date | September 2013 |
| Place in performance rating | 489 |
| Price now | $2,250 |
| Processor Number | E5-2470V2 |
| Series | Intel® Xeon® Processor E5 v2 Family |
| Status | Launched |
| Value for money (0-100) | 1.68 |
| Vertical segment | Server |
Performance |
|
| 64 bit support | |
| Base frequency | 2.40 GHz |
| Bus Speed | 8 GT/s QPI |
| Die size | 160 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 25600 KB (shared) |
| Manufacturing process technology | 22 nm |
| Maximum core temperature | 80°C |
| Maximum frequency | 3.20 GHz |
| Number of cores | 10 |
| Number of QPI Links | 1 |
| Number of threads | 20 |
| Transistor count | 1400 million |
| VID voltage range | 0.65-1.30V |
Memory |
|
| ECC memory support | |
| Max memory channels | 3 |
| Maximum memory bandwidth | 38.4 GB/s |
| Maximum memory size | 384 GB |
| Supported memory types | DDR3 800/1066/1333/1600 |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 2 |
| Package Size | 45mm x 42.5mm |
| Sockets supported | FCLGA1356 |
| Thermal Design Power (TDP) | 95 Watt |
Peripherals |
|
| Max number of PCIe lanes | 24 |
| PCI Express revision | 3.0 |
| PCIe configurations | x4, x8, x16 |
| Scalability | 2S Only |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® OS Guard | |
| Intel® Secure Key technology | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® AVX |
| Intel 64 | |
| Intel® Advanced Vector Extensions (AVX) | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Physical Address Extensions (PAE) | 46-bit |
| Thermal Monitoring | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
Navigation
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