Intel Xeon E5-2650 v3 processor review
Xeon E5-2650 v3 processor released by Intel; release date: Q3'14. The processor is designed for server-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 10, threads - 20. Maximum CPU clock speed - 3.00 GHz. Maximum operating temperature - 78.9°C. Manufacturing process technology - 22 nm.
Supported memory types: DDR4 1600/1866/2133. Maximum memory size: 768 GB.
Supported socket types: FCLGA2011-3. Maximum number of processors in a configuration - 2. Power consumption (TDP): 105 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1622 |
| PassMark - CPU mark | 19780 |
| Geekbench 4 - Single Core | 689 |
| Geekbench 4 - Multi-Core | 6066 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 311.954 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 160.724 mHash/s |
Specifications (specs)
Essentials |
|
| Architecture codename | Haswell |
| Launch date | Q3'14 |
| Place in performance rating | 794 |
| Processor Number | E5-2650V3 |
| Series | Intel® Xeon® Processor E5 v3 Family |
| Status | Launched |
| Vertical segment | Server |
Performance |
|
| 64 bit support | |
| Base frequency | 2.30 GHz |
| Bus Speed | 9.6 GT/s QPI |
| Manufacturing process technology | 22 nm |
| Maximum core temperature | 78.9°C |
| Maximum frequency | 3.00 GHz |
| Number of cores | 10 |
| Number of QPI Links | 2 |
| Number of threads | 20 |
| VID voltage range | 0.65V–1.30V |
Memory |
|
| Max memory channels | 4 |
| Maximum memory bandwidth | 68 GB/s |
| Maximum memory size | 768 GB |
| Supported memory types | DDR4 1600/1866/2133 |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 2 |
| Package Size | 52.5mm x 45mm |
| Sockets supported | FCLGA2011-3 |
| Thermal Design Power (TDP) | 105 Watt |
Peripherals |
|
| Max number of PCIe lanes | 40 |
| PCI Express revision | 3.0 |
| PCIe configurations | x4, x8, x16 |
| Scalability | 2S |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® OS Guard | |
| Intel® Secure Key technology | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® AVX2 |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Physical Address Extensions (PAE) | 46-bit |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
Navigation
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