AMD EPYC 9474F vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 9474F and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 9474F

  • 22 more cores, run more applications at once: 48 vs 26
  • 44 more threads: 96 vs 52
  • Around 11% higher clock speed: 4.1 GHz vs 3.70 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Number of cores 48 vs 26
Number of threads 96 vs 52
Maximum frequency 4.1 GHz vs 3.70 GHz
Manufacturing process technology 5 nm vs 14 nm

Reasons to consider the Intel Xeon Platinum 8170

  • 2.2x lower typical power consumption: 165 Watt vs 360 Watt
Thermal Design Power (TDP) 165 Watt vs 360 Watt

Compare benchmarks

CPU 1: AMD EPYC 9474F
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 9474F Intel Xeon Platinum 8170
PassMark - Single thread mark 3243
PassMark - CPU mark 148891
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 9474F Intel Xeon Platinum 8170

Essentials

Architecture codename Zen 4 (Genoa) Skylake
Launch date 10 Nov 2022 Q3'17
Place in performance rating 5 2
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched
Vertical segment Server

Performance

Base frequency 3.6 GHz 2.10 GHz
Die size 8x 72 mm²
L1 cache 64K (per core)
L2 cache 1MB (per core)
L3 cache 256MB (shared)
Manufacturing process technology 5 nm 14 nm
Maximum frequency 4.1 GHz 3.70 GHz
Number of cores 48 26
Number of threads 96 52
Transistor count 52,560 million
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Supported memory types DDR5-4800 MHz, Twelve-channel DDR4-2666
Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz

Compatibility

Configurable TDP 320-400 W
Max number of CPUs in a configuration 2
Sockets supported SP5 FCLGA3647
Thermal Design Power (TDP) 360 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 128 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)