AMD Ryzen 7 7840HS vs AMD Ryzen 7 PRO 6850HS

Comparative analysis of AMD Ryzen 7 7840HS and AMD Ryzen 7 PRO 6850HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the AMD Ryzen 7 7840HS

  • CPU is newer: launch date 8 month(s) later
  • Around 9% higher clock speed: 5.1 GHz vs 4.7 GHz
  • Around 5% higher maximum core temperature: 100°C vs 95 °C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
  • Around 15% better performance in PassMark - Single thread mark: 3783 vs 3294
  • Around 30% better performance in PassMark - CPU mark: 28903 vs 22259
Specifications (specs)
Launch date Jan 2023 vs 19 Apr 2022
Maximum frequency 5.1 GHz vs 4.7 GHz
Maximum core temperature 100°C vs 95 °C
Manufacturing process technology 4 nm vs 6 nm
Benchmarks
PassMark - Single thread mark 3783 vs 3294
PassMark - CPU mark 28903 vs 22259

Reasons to consider the AMD Ryzen 7 PRO 6850HS

  • 524288x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
L2 cache 4 MB vs 1MB (per core)
L3 cache 16 MB vs 16MB (shared)

Compare benchmarks

CPU 1: AMD Ryzen 7 7840HS
CPU 2: AMD Ryzen 7 PRO 6850HS

PassMark - Single thread mark
CPU 1
CPU 2
3783
3294
PassMark - CPU mark
CPU 1
CPU 2
28903
22259
Name AMD Ryzen 7 7840HS AMD Ryzen 7 PRO 6850HS
PassMark - Single thread mark 3783 3294
PassMark - CPU mark 28903 22259
3DMark Fire Strike - Physics Score 7338

Compare specifications (specs)

AMD Ryzen 7 7840HS AMD Ryzen 7 PRO 6850HS

Essentials

Architecture codename Zen 4 Zen 3+
Launch date Jan 2023 19 Apr 2022
Place in performance rating 392 422
Vertical segment Mobile

Performance

Base frequency 3.8 GHz 3.2 GHz
Die size 178 mm² 208 mm²
L1 cache 64K (per core) 512 KB
L2 cache 1MB (per core) 4 MB
L3 cache 16MB (shared) 16 MB
Manufacturing process technology 4 nm 6 nm
Maximum core temperature 100°C 95 °C
Maximum frequency 5.1 GHz 4.7 GHz
Number of cores 8 8
Number of threads 16 16
Unlocked

Memory

ECC memory support
Supported memory types DDR5-5600 MHz, Dual-channel DDR5-4800
Max memory channels 2

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP8 FP7
Thermal Design Power (TDP) 35 Watt 35 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes 20
PCI Express revision 4.0

Graphics

Graphics max dynamic frequency 2200 MHz

Graphics interfaces

DisplayPort
HDMI