AMD Ryzen 7 7840HS vs AMD Ryzen 7 PRO 6850HS
Comparative analysis of AMD Ryzen 7 7840HS and AMD Ryzen 7 PRO 6850HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 7 7840HS
- CPU is newer: launch date 8 month(s) later
- Around 9% higher clock speed: 5.1 GHz vs 4.7 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
- Around 15% better performance in PassMark - Single thread mark: 3784 vs 3294
- Around 30% better performance in PassMark - CPU mark: 28902 vs 22259
Specifications (specs) | |
Launch date | Jan 2023 vs 19 Apr 2022 |
Maximum frequency | 5.1 GHz vs 4.7 GHz |
Maximum core temperature | 100°C vs 95 °C |
Manufacturing process technology | 4 nm vs 6 nm |
Benchmarks | |
PassMark - Single thread mark | 3784 vs 3294 |
PassMark - CPU mark | 28902 vs 22259 |
Reasons to consider the AMD Ryzen 7 PRO 6850HS
- 524288x more L2 cache, more data can be stored in the L2 cache for quick access later
- 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
L2 cache | 4 MB vs 1MB (per core) |
L3 cache | 16 MB vs 16MB (shared) |
Compare benchmarks
CPU 1: AMD Ryzen 7 7840HS
CPU 2: AMD Ryzen 7 PRO 6850HS
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 7840HS | AMD Ryzen 7 PRO 6850HS |
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PassMark - Single thread mark | 3784 | 3294 |
PassMark - CPU mark | 28902 | 22259 |
3DMark Fire Strike - Physics Score | 7338 |
Compare specifications (specs)
AMD Ryzen 7 7840HS | AMD Ryzen 7 PRO 6850HS | |
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Essentials |
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Architecture codename | Zen 4 | Zen 3+ |
Launch date | Jan 2023 | 19 Apr 2022 |
Place in performance rating | 394 | 422 |
Vertical segment | Mobile | |
Performance |
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Base frequency | 3.8 GHz | 3.2 GHz |
Die size | 178 mm² | 208 mm² |
L1 cache | 64K (per core) | 512 KB |
L2 cache | 1MB (per core) | 4 MB |
L3 cache | 16MB (shared) | 16 MB |
Manufacturing process technology | 4 nm | 6 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 5.1 GHz | 4.7 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5-5600 MHz, Dual-channel | DDR5-4800 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP8 | FP7 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Graphics |
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Graphics max dynamic frequency | 2200 MHz | |
Graphics interfaces |
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DisplayPort | ||
HDMI |