AMD Athlon Neo X2 L335 vs Intel Pentium Dual Core T2410
Comparative analysis of AMD Athlon Neo X2 L335 and Intel Pentium Dual Core T2410 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Athlon Neo X2 L335
- CPU is newer: launch date 1 year(s) 0 month(s) later
- Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Launch date | 1 October 2009 vs 1 September 2008 |
Thermal Design Power (TDP) | 18 Watt vs 35 Watt |
Reasons to consider the Intel Pentium Dual Core T2410
- Around 25% higher clock speed: 2 GHz vs 1.6 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 25% better performance in PassMark - Single thread mark: 712 vs 570
- Around 7% better performance in PassMark - CPU mark: 566 vs 529
Specifications (specs) | |
Maximum frequency | 2 GHz vs 1.6 GHz |
L2 cache | 1024 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 712 vs 570 |
PassMark - CPU mark | 566 vs 529 |
Compare benchmarks
CPU 1: AMD Athlon Neo X2 L335
CPU 2: Intel Pentium Dual Core T2410
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Athlon Neo X2 L335 | Intel Pentium Dual Core T2410 |
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PassMark - Single thread mark | 570 | 712 |
PassMark - CPU mark | 529 | 566 |
Geekbench 4 - Single Core | 786 | |
Geekbench 4 - Multi-Core | 1289 |
Compare specifications (specs)
AMD Athlon Neo X2 L335 | Intel Pentium Dual Core T2410 | |
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Essentials |
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Architecture codename | Congo | Merom |
Launch date | 1 October 2009 | 1 September 2008 |
Place in performance rating | 2684 | 2690 |
Series | 2x AMD Athlon Neo | Intel Pentium Dual Core |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Front-side bus (FSB) | 800 MHz | 533 MHz |
L1 cache | 128 KB | |
L2 cache | 512 KB | 1024 KB |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 95 °C | |
Maximum frequency | 1.6 GHz | 2 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Die size | 111 mm | |
Compatibility |
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Sockets supported | ASB1 BGA | P, 478Pin |
Thermal Design Power (TDP) | 18 Watt | 35 Watt |
Advanced Technologies |
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VirusProtect | ||
Virtualization |
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AMD Virtualization (AMD-V™) |