AMD Athlon X2 L310 vs AMD Mobile Sempron 200U

Comparative analysis of AMD Athlon X2 L310 and AMD Mobile Sempron 200U processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Athlon X2 L310

  • CPU is newer: launch date 7 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 20% higher clock speed: 1.2 GHz vs 1 GHz
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 27% better performance in PassMark - Single thread mark: 395 vs 311
  • 2.6x better performance in PassMark - CPU mark: 329 vs 125
Specifications (specs)
Launch date 10 September 2009 vs 16 January 2009
Number of cores 2 vs 1
Number of threads 2 vs 1
Maximum frequency 1.2 GHz vs 1 GHz
L2 cache 1024 KB vs 256 KB
Benchmarks
PassMark - Single thread mark 395 vs 311
PassMark - CPU mark 329 vs 125

Reasons to consider the AMD Mobile Sempron 200U

  • Around 63% lower typical power consumption: 8 Watt vs 13 Watt
Thermal Design Power (TDP) 8 Watt vs 13 Watt

Compare benchmarks

CPU 1: AMD Athlon X2 L310
CPU 2: AMD Mobile Sempron 200U

PassMark - Single thread mark
CPU 1
CPU 2
395
311
PassMark - CPU mark
CPU 1
CPU 2
329
125
Name AMD Athlon X2 L310 AMD Mobile Sempron 200U
PassMark - Single thread mark 395 311
PassMark - CPU mark 329 125
Geekbench 4 - Single Core 120
Geekbench 4 - Multi-Core 213

Compare specifications (specs)

AMD Athlon X2 L310 AMD Mobile Sempron 200U

Essentials

Architecture codename Conesus Huron
Launch date 10 September 2009 16 January 2009
Place in performance rating 3259 3239
Series 2x AMD Athlon AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 800 MHz 1600 MHz
L1 cache 256 KB
L2 cache 1024 KB 256 KB
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 95 °C
Maximum frequency 1.2 GHz 1 GHz
Number of cores 2 1
Number of threads 2 1

Compatibility

Sockets supported BGA / 638 lidless micro-PGA ASB1
Thermal Design Power (TDP) 13 Watt 8 Watt

Advanced Technologies

VirusProtect

Virtualization

AMD Virtualization (AMD-V™)