AMD Athlon X2 L310 vs Intel Core 2 Duo SU7300
Comparative analysis of AMD Athlon X2 L310 and Intel Core 2 Duo SU7300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo SU7300
- Around 8% higher clock speed: 1.3 GHz vs 1.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 30% lower typical power consumption: 10 Watt vs 13 Watt
- Around 48% better performance in Geekbench 4 - Single Core: 177 vs 120
- Around 45% better performance in Geekbench 4 - Multi-Core: 309 vs 213
Specifications (specs) | |
Maximum frequency | 1.3 GHz vs 1.2 GHz |
Manufacturing process technology | 45 nm vs 65 nm |
L2 cache | 3 MB vs 1024 KB |
Thermal Design Power (TDP) | 10 Watt vs 13 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 177 vs 120 |
Geekbench 4 - Multi-Core | 309 vs 213 |
Compare benchmarks
CPU 1: AMD Athlon X2 L310
CPU 2: Intel Core 2 Duo SU7300
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | AMD Athlon X2 L310 | Intel Core 2 Duo SU7300 |
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PassMark - Single thread mark | 395 | |
PassMark - CPU mark | 329 | |
Geekbench 4 - Single Core | 120 | 177 |
Geekbench 4 - Multi-Core | 213 | 309 |
Compare specifications (specs)
AMD Athlon X2 L310 | Intel Core 2 Duo SU7300 | |
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Essentials |
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Architecture codename | Conesus | Penryn |
Launch date | 10 September 2009 | 1 September 2009 |
Place in performance rating | 3259 | 3290 |
Series | 2x AMD Athlon | Intel Core 2 Duo |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Front-side bus (FSB) | 800 MHz | 800 MHz |
L1 cache | 256 KB | |
L2 cache | 1024 KB | 3 MB |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 95 °C | |
Maximum frequency | 1.2 GHz | 1.3 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Die size | 107 mm | |
Transistor count | 410 Million | |
Compatibility |
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Sockets supported | BGA / 638 lidless micro-PGA | BGA956 |
Thermal Design Power (TDP) | 13 Watt | 10 Watt |
Advanced Technologies |
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VirusProtect | ||
Enhanced Intel SpeedStep® technology | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Security & Reliability |
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Intel® Trusted Execution technology (TXT) |