AMD Athlon X4 530 vs Intel Core 2 Duo E6700

Comparative analysis of AMD Athlon X4 530 and Intel Core 2 Duo E6700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Athlon X4 530

  • 2 more cores, run more applications at once: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 65 nm
  • 2.6x lower typical power consumption: 25 Watt vs 65 Watt
  • Around 80% better performance in PassMark - CPU mark: 1786 vs 990
Specifications (specs)
Number of cores 4 vs 2
Manufacturing process technology 28 nm vs 65 nm
Thermal Design Power (TDP) 25 Watt vs 65 Watt
Benchmarks
PassMark - CPU mark 1786 vs 990

Reasons to consider the Intel Core 2 Duo E6700

  • Around 48% better performance in PassMark - Single thread mark: 1023 vs 690
Benchmarks
PassMark - Single thread mark 1023 vs 690

Compare benchmarks

CPU 1: AMD Athlon X4 530
CPU 2: Intel Core 2 Duo E6700

PassMark - Single thread mark
CPU 1
CPU 2
690
1023
PassMark - CPU mark
CPU 1
CPU 2
1786
990
Name AMD Athlon X4 530 Intel Core 2 Duo E6700
PassMark - Single thread mark 690 1023
PassMark - CPU mark 1786 990
Geekbench 4 - Single Core 317
Geekbench 4 - Multi-Core 564

Compare specifications (specs)

AMD Athlon X4 530 Intel Core 2 Duo E6700

Essentials

Architecture codename Kabini Conroe
OPN Tray AD530XJAH44HM
Place in performance rating 2685 2712
Vertical segment Desktop Desktop
Launch date Q3'06
Processor Number E6700
Series Legacy Intel® Core™ Processors
Status Discontinued

Performance

64 bit support
Base frequency 2000 MHz 2.66 GHz
L1 cache 256 KB
L2 cache 2 MB
L3 cache None
Manufacturing process technology 28 nm 65 nm
Number of cores 4 2
Number of threads 4
Bus Speed 1066 MHz FSB
Die size 143 mm2
Maximum core temperature 60.1°C
Transistor count 291 million
VID voltage range 0.8500V-1.5V

Memory

ECC memory support
Max memory channels 1
Maximum memory size 16 GB
Supported memory types DDR3

Graphics

Unified Video Decoder (UVD)
Video Codec Engine (VCE)

Compatibility

Sockets supported AM1 PLGA775
Thermal Design Power (TDP) 25 Watt 65 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W

Peripherals

PCI Express revision 2.0

Advanced Technologies

Enhanced Virus Protection (EVP)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)