AMD EPYC 7302P vs Intel Xeon E-2244G
Comparative analysis of AMD EPYC 7302P and Intel Xeon E-2244G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7302P
- CPU is newer: launch date 2 month(s) later
- 12 more cores, run more applications at once: 16 vs 4
- 24 more threads: 32 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 16x more L3 cache, more data can be stored in the L3 cache for quick access later
- 32x more maximum memory size: 4 TB vs 128 GB
- 3.4x better performance in PassMark - CPU mark: 32669 vs 9604
| Specifications (specs) | |
| Launch date | 7 Aug 2019 vs 27 May 2019 |
| Number of cores | 16 vs 4 |
| Number of threads | 32 vs 8 |
| Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
| L1 cache | 1 MB vs 256 KB |
| L2 cache | 8 MB vs 1 MB |
| L3 cache | 128 MB vs 8 MB |
| Maximum memory size | 4 TB vs 128 GB |
| Benchmarks | |
| PassMark - CPU mark | 32669 vs 9604 |
Reasons to consider the Intel Xeon E-2244G
- Around 45% higher clock speed: 4.80 GHz vs 3.3 GHz
- 2.2x lower typical power consumption: 71 Watt vs 155 Watt
- Around 43% better performance in PassMark - Single thread mark: 2689 vs 1886
| Specifications (specs) | |
| Maximum frequency | 4.80 GHz vs 3.3 GHz |
| Thermal Design Power (TDP) | 71 Watt vs 155 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2689 vs 1886 |
Compare benchmarks
CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon E-2244G
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
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| Name | AMD EPYC 7302P | Intel Xeon E-2244G |
|---|---|---|
| PassMark - Single thread mark | 1886 | 2689 |
| PassMark - CPU mark | 32669 | 9604 |
Compare specifications (specs)
| AMD EPYC 7302P | Intel Xeon E-2244G | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Coffee Lake |
| Launch date | 7 Aug 2019 | 27 May 2019 |
| Launch price (MSRP) | $825 | $272 |
| OPN PIB | 100-100000049WOF | |
| OPN Tray | 100-000000049 | |
| Place in performance rating | 893 | 851 |
| Vertical segment | Server | Server |
| Processor Number | E-2244G | |
Performance |
||
| Base frequency | 3.0 GHz | 3.80 GHz |
| L1 cache | 1 MB | 256 KB |
| L2 cache | 8 MB | 1 MB |
| L3 cache | 128 MB | 8 MB |
| Manufacturing process technology | 7 nm, 14 nm | 14 nm |
| Maximum frequency | 3.3 GHz | 4.80 GHz |
| Number of cores | 16 | 4 |
| Number of threads | 32 | 8 |
| Unlocked | ||
| 64 bit support | ||
| Maximum case temperature (TCase) | 69.3 °C | |
| Maximum core temperature | 100 °C | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 8 | 2 |
| Maximum memory bandwidth | 190.7 GB/s | 39.74 GB/s |
| Maximum memory size | 4 TB | 128 GB |
| Supported memory types | DDR4-3200 | DDR4-2666 |
Compatibility |
||
| Socket Count | 1P | |
| Sockets supported | SP3 | FCLGA1151 |
| Thermal Design Power (TDP) | 155 Watt | 71 Watt |
| Max number of CPUs in a configuration | 1 | |
Peripherals |
||
| Max number of PCIe lanes | 128 | 16 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | x16, x8 | 1x16,2x8,1x8+2x4 |
| Scalability | 1S Only | |
Advanced Technologies |
||
| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
| Device ID | 0x3E96 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 128 GB | |
| Processor graphics | Intel UHD Graphics P630 | |
Graphics interfaces |
||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2160@24Hz | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
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