AMD EPYC 7402P vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 7402P and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 7402P

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
  • 5.3x more maximum memory size: 4 TB vs 768 GB
Manufacturing process technology 7 nm, 14 nm vs 14 nm
Maximum memory size 4 TB vs 768 GB

Reasons to consider the Intel Xeon Platinum 8170

  • 2 more cores, run more applications at once: 26 vs 24
  • 4 more threads: 52 vs 48
  • Around 10% higher clock speed: 3.70 GHz vs 3.35 GHz
  • Around 9% lower typical power consumption: 165 Watt vs 180 Watt
Number of cores 26 vs 24
Number of threads 52 vs 48
Maximum frequency 3.70 GHz vs 3.35 GHz
Thermal Design Power (TDP) 165 Watt vs 180 Watt

Compare benchmarks

CPU 1: AMD EPYC 7402P
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 7402P Intel Xeon Platinum 8170
PassMark - Single thread mark 1970
PassMark - CPU mark 43091
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 7402P Intel Xeon Platinum 8170

Essentials

Architecture codename Zen 2 Skylake
Launch date 7 Aug 2019 Q3'17
Launch price (MSRP) $1250
OPN PIB 100-100000048WOF
OPN Tray 100-000000048
Place in performance rating 602 4
Vertical segment Server Server
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched

Performance

Base frequency 2.8 GHz 2.10 GHz
L1 cache 1.5 MB
L2 cache 12 MB
L3 cache 128 MB
Manufacturing process technology 7 nm, 14 nm 14 nm
Maximum frequency 3.35 GHz 3.70 GHz
Number of cores 24 26
Number of threads 48 52
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Max memory channels 8 6
Maximum memory bandwidth 190.7 GB/s
Maximum memory size 4 TB 768 GB
Supported memory types DDR4-3200 DDR4-2666
Supported memory frequency 2666 MHz

Compatibility

Max number of CPUs in a configuration 1
Sockets supported SP3 FCLGA3647
Thermal Design Power (TDP) 180 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

Max number of PCIe lanes 128 48
PCI Express revision 4.0 3.0
PCIe configurations x16, x8
Scalability S8S

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)