AMD EPYC 8024P vs AMD EPYC 7262

Comparative analysis of AMD EPYC 8024P and AMD EPYC 7262 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8024P

  • CPU is newer: launch date 4 year(s) 1 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 72% lower typical power consumption: 90 Watt vs 155 Watt
  • Around 17% better performance in PassMark - Single thread mark: 2371 vs 2023
Specifications (specs)
Launch date 18 Sep 2023 vs 7 Aug 2019
Manufacturing process technology 5 nm vs 7 nm, 14 nm
L2 cache 1 MB (per core) vs 4 MB
Thermal Design Power (TDP) 90 Watt vs 155 Watt
Benchmarks
PassMark - Single thread mark 2371 vs 2023

Reasons to consider the AMD EPYC 7262

  • Around 13% higher clock speed: 3.4 GHz vs 3 GHz
  • 4x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 67% better performance in PassMark - CPU mark: 34227 vs 20556
Specifications (specs)
Maximum frequency 3.4 GHz vs 3 GHz
L3 cache 128 MB vs 32 MB (shared)
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - CPU mark 34227 vs 20556

Compare benchmarks

CPU 1: AMD EPYC 8024P
CPU 2: AMD EPYC 7262

PassMark - Single thread mark
CPU 1
CPU 2
2371
2023
PassMark - CPU mark
CPU 1
CPU 2
20556
34227
Name AMD EPYC 8024P AMD EPYC 7262
PassMark - Single thread mark 2371 2023
PassMark - CPU mark 20556 34227

Compare specifications (specs)

AMD EPYC 8024P AMD EPYC 7262

Essentials

Launch date 18 Sep 2023 7 Aug 2019
Launch price (MSRP) $409 $575
Place in performance rating 839 810
Architecture codename Zen 2
OPN PIB 100-100000041WOF
OPN Tray 100-000000041
Vertical segment Server

Performance

Base frequency 2.4 GHz 3.2 GHz
Die size 73 mm²
L1 cache 64 KB (per core) 512 KB
L2 cache 1 MB (per core) 4 MB
L3 cache 32 MB (shared) 128 MB
Manufacturing process technology 5 nm 7 nm, 14 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 3.4 GHz
Number of cores 8 8
Number of threads 16 16
Transistor count 8,875 million
Unlocked

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200
Max memory channels 8
Maximum memory bandwidth 190.7 GB/s
Maximum memory size 4 TB

Compatibility

Configurable TDP 70-100 Watt
Max number of CPUs in a configuration 1 2
Sockets supported SP6 SP3
Thermal Design Power (TDP) 90 Watt 155 Watt

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only) x16, x8
Max number of PCIe lanes 128
PCI Express revision 4.0

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions

Virtualization

AMD Virtualization (AMD-V™)