AMD EPYC 8024P vs Intel Xeon E5-2678 v3
Comparative analysis of AMD EPYC 8024P and Intel Xeon E5-2678 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD EPYC 8024P
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 7% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 33% lower typical power consumption: 90 Watt vs 120 Watt
Manufacturing process technology | 5 nm vs 22 nm |
L2 cache | 1 MB (per core) vs 3 MB |
L3 cache | 32 MB (shared) vs 30 MB |
Thermal Design Power (TDP) | 90 Watt vs 120 Watt |
Reasons to consider the Intel Xeon E5-2678 v3
- 4 more cores, run more applications at once: 12 vs 8
- 8 more threads: 24 vs 16
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
Number of cores | 12 vs 8 |
Number of threads | 24 vs 16 |
L1 cache | 768 KB vs 64 KB (per core) |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: AMD EPYC 8024P
CPU 2: Intel Xeon E5-2678 v3
Name | AMD EPYC 8024P | Intel Xeon E5-2678 v3 |
---|---|---|
PassMark - Single thread mark | 2371 | |
PassMark - CPU mark | 20556 | |
3DMark Fire Strike - Physics Score | 7451 |
Compare specifications (specs)
AMD EPYC 8024P | Intel Xeon E5-2678 v3 | |
---|---|---|
Essentials |
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Launch date | 18 Sep 2023 | |
Launch price (MSRP) | $409 | |
Place in performance rating | 860 | 867 |
Architecture codename | Haswell-EP | |
Family | Intel Xeon E5-2600 v3 | |
Processor Number | E5-2678 v3 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.4 GHz | 2500 MHz |
Die size | 73 mm² | |
L1 cache | 64 KB (per core) | 768 KB |
L2 cache | 1 MB (per core) | 3 MB |
L3 cache | 32 MB (shared) | 30 MB |
Manufacturing process technology | 5 nm | 22 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | |
Number of cores | 8 | 12 |
Number of threads | 16 | 24 |
Transistor count | 8,875 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4 |
Max memory channels | 2 | |
Compatibility |
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Configurable TDP | 70-100 Watt | |
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | SP6 | LGA2011-3 (R3) |
Thermal Design Power (TDP) | 90 Watt | 120 Watt |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | |
Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |