AMD EPYC 8024P vs Intel Xeon E5-2678 v3

Comparative analysis of AMD EPYC 8024P and Intel Xeon E5-2678 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the AMD EPYC 8024P

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
  • 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 7% more L3 cache; more data can be stored in the L3 cache for quick access later
  • Around 33% lower typical power consumption: 90 Watt vs 120 Watt
Manufacturing process technology 5 nm vs 22 nm
L2 cache 1 MB (per core) vs 3 MB
L3 cache 32 MB (shared) vs 30 MB
Thermal Design Power (TDP) 90 Watt vs 120 Watt

Reasons to consider the Intel Xeon E5-2678 v3

  • 4 more cores, run more applications at once: 12 vs 8
  • 8 more threads: 24 vs 16
  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
Number of cores 12 vs 8
Number of threads 24 vs 16
L1 cache 768 KB vs 64 KB (per core)
Max number of CPUs in a configuration 2 vs 1

Compare benchmarks

CPU 1: AMD EPYC 8024P
CPU 2: Intel Xeon E5-2678 v3

Name AMD EPYC 8024P Intel Xeon E5-2678 v3
PassMark - Single thread mark 2371
PassMark - CPU mark 20556
3DMark Fire Strike - Physics Score 7451

Compare specifications (specs)

AMD EPYC 8024P Intel Xeon E5-2678 v3

Essentials

Launch date 18 Sep 2023
Launch price (MSRP) $409
Place in performance rating 860 867
Architecture codename Haswell-EP
Family Intel Xeon E5-2600 v3
Processor Number E5-2678 v3
Vertical segment Server

Performance

Base frequency 2.4 GHz 2500 MHz
Die size 73 mm²
L1 cache 64 KB (per core) 768 KB
L2 cache 1 MB (per core) 3 MB
L3 cache 32 MB (shared) 30 MB
Manufacturing process technology 5 nm 22 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz
Number of cores 8 12
Number of threads 16 24
Transistor count 8,875 million
Unlocked
64 bit support
Bus Speed 5 GT/s DMI

Memory

ECC memory support
Supported memory types DDR5 DDR4
Max memory channels 2

Compatibility

Configurable TDP 70-100 Watt
Max number of CPUs in a configuration 1 2
Sockets supported SP6 LGA2011-3 (R3)
Thermal Design Power (TDP) 90 Watt 120 Watt

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes 40
PCI Express revision 3.0

Security & Reliability

Execute Disable Bit (EDB)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)