AMD EPYC 8324P vs Intel Xeon W-1390
Comparative analysis of AMD EPYC 8324P and Intel Xeon W-1390 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 8324P
- CPU is newer: launch date 2 year(s) 4 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
- 8x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.4x better performance in PassMark - CPU mark: 57127 vs 23902
Specifications (specs) | |
Launch date | 18 Sep 2023 vs 6 May 2021 |
Manufacturing process technology | 5 nm vs 14 nm |
L3 cache | 128 MB (shared) vs 16 MB |
Benchmarks | |
PassMark - CPU mark | 57127 vs 23902 |
Reasons to consider the Intel Xeon W-1390
- Around 73% higher clock speed: 5.20 GHz vs 3 GHz
- 10x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.3x lower typical power consumption: 80 Watt vs 180 Watt
- Around 44% better performance in PassMark - Single thread mark: 3414 vs 2367
Specifications (specs) | |
Maximum frequency | 5.20 GHz vs 3 GHz |
L1 cache | 640 KB vs 64 KB (per core) |
L2 cache | 4 MB vs 1 MB (per core) |
Thermal Design Power (TDP) | 80 Watt vs 180 Watt |
Benchmarks | |
PassMark - Single thread mark | 3414 vs 2367 |
Compare benchmarks
CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon W-1390
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | AMD EPYC 8324P | Intel Xeon W-1390 |
---|---|---|
PassMark - Single thread mark | 2367 | 3414 |
PassMark - CPU mark | 57127 | 23902 |
Compare specifications (specs)
AMD EPYC 8324P | Intel Xeon W-1390 | |
---|---|---|
Essentials |
||
Launch date | 18 Sep 2023 | 6 May 2021 |
Launch price (MSRP) | $1895 | $494 - $498 |
Place in performance rating | 365 | 360 |
Architecture codename | Rocket Lake | |
Processor Number | W-1390 | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | |
Performance |
||
Base frequency | 2.65 GHz | 2.80 GHz |
Die size | 4x 73 mm² | |
L1 cache | 64 KB (per core) | 640 KB |
L2 cache | 1 MB (per core) | 4 MB |
L3 cache | 128 MB (shared) | 16 MB |
Manufacturing process technology | 5 nm | 14 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | 5.20 GHz |
Number of cores | 32 | |
Number of threads | 64 | |
Transistor count | 35,500 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s | |
Maximum core temperature | 100°C | |
Memory |
||
ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 2 | |
Maximum memory bandwidth | 50 GB/s | |
Maximum memory size | 128 GB | |
Compatibility |
||
Configurable TDP | 155-225 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | SP6 | FCLGA1200 |
Thermal Design Power (TDP) | 180 Watt | 80 Watt |
Package Size | 37.5 mm x 37.5 mm | |
Thermal Solution | PCG 2019B | |
Peripherals |
||
PCIe configurations | Gen 5, 96 Lanes, (CPU only) | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Scalability | 1S Only | |
Graphics |
||
Device ID | 0x4C90 | |
Execution Units | 32 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P750 | |
Graphics interfaces |
||
Number of displays supported | 3 | |
Graphics image quality |
||
4K resolution support | ||
Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
||
DirectX | 12.1 | |
OpenGL | 4.5 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |