AMD EPYC 9554 vs Intel Xeon Platinum 8170
Comparative analysis of AMD EPYC 9554 and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD EPYC 9554
- 38 more cores, run more applications at once: 64 vs 26
- 76 more threads: 128 vs 52
- Around 1% higher clock speed: 3.75 GHz vs 3.70 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
| Number of cores | 64 vs 26 |
| Number of threads | 128 vs 52 |
| Maximum frequency | 3.75 GHz vs 3.70 GHz |
| Manufacturing process technology | 5 nm vs 14 nm |
Reasons to consider the Intel Xeon Platinum 8170
- 2.2x lower typical power consumption: 165 Watt vs 360 Watt
| Thermal Design Power (TDP) | 165 Watt vs 360 Watt |
Compare benchmarks
CPU 1: AMD EPYC 9554
CPU 2: Intel Xeon Platinum 8170
| Name | AMD EPYC 9554 | Intel Xeon Platinum 8170 |
|---|---|---|
| PassMark - Single thread mark | 2950 | |
| PassMark - CPU mark | 146171 | |
| Geekbench 4 - Single Core | 4221 | |
| Geekbench 4 - Multi-Core | 33793 |
Compare specifications (specs)
| AMD EPYC 9554 | Intel Xeon Platinum 8170 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 4 (Genoa) | Skylake |
| Launch date | 10 Nov 2022 | Q3'17 |
| Launch price (MSRP) | $9087 | |
| Place in performance rating | 9 | 1 |
| Processor Number | 8170 | |
| Series | Intel® Xeon® Scalable Processors | |
| Status | Launched | |
| Vertical segment | Server | |
Performance |
||
| Base frequency | 3.1 GHz | 2.10 GHz |
| Die size | 8x 72 mm² | |
| L1 cache | 64K (per core) | |
| L2 cache | 1MB (per core) | |
| L3 cache | 256MB (shared) | |
| Manufacturing process technology | 5 nm | 14 nm |
| Maximum frequency | 3.75 GHz | 3.70 GHz |
| Number of cores | 64 | 26 |
| Number of threads | 128 | 52 |
| Transistor count | 52,560 million | |
| Unlocked | ||
| Maximum core temperature | 89°C | |
| Number of Ultra Path Interconnect (UPI) Links | 3 | |
Memory |
||
| ECC memory support | ||
| Supported memory types | DDR5-4800 MHz, Twelve-channel | DDR4-2666 |
| Max memory channels | 6 | |
| Maximum memory size | 768 GB | |
| Supported memory frequency | 2666 MHz | |
Compatibility |
||
| Configurable TDP | 320-400 Watt | |
| Max number of CPUs in a configuration | 2 | |
| Sockets supported | SP5 | FCLGA3647 |
| Thermal Design Power (TDP) | 360 Watt | 165 Watt |
| Low Halogen Options Available | ||
| Package Size | 76.0mm x 56.5mm | |
Peripherals |
||
| PCIe configurations | Gen 5, 128 Lanes, (CPU only) | |
| Max number of PCIe lanes | 48 | |
| PCI Express revision | 3.0 | |
| Scalability | S8S | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||