AMD EPYC 9654 vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 9654 and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 9654

  • 70 more cores, run more applications at once: 96 vs 26
  • 140 more threads: 192 vs 52
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Number of cores 96 vs 26
Number of threads 192 vs 52
Manufacturing process technology 5 nm vs 14 nm

Reasons to consider the Intel Xeon Platinum 8170

  • Around 2305% higher maximum core temperature: 89°C vs 3.7 GHz
  • 2.2x lower typical power consumption: 165 Watt vs 360 Watt
Maximum core temperature 89°C vs 3.7 GHz
Thermal Design Power (TDP) 165 Watt vs 360 Watt

Compare benchmarks

CPU 1: AMD EPYC 9654
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 9654 Intel Xeon Platinum 8170
PassMark - Single thread mark 2749
PassMark - CPU mark 146557
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 9654 Intel Xeon Platinum 8170

Essentials

Architecture codename Zen 4 Skylake
Launch date 10 Nov 2022 Q3'17
Launch price (MSRP) $11805
OPN Tray 100-100000789
Place in performance rating 6 4
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched
Vertical segment Server

Performance

Base frequency 2.4 GHz 2.10 GHz
Die size 72 mm²
L1 cache 6 MB
L2 cache 96 MB
L3 cache 384 MB
Manufacturing process technology 5 nm 14 nm
Maximum core temperature 3.7 GHz 89°C
Number of cores 96 26
Number of threads 192 52
Transistor count 78840 million
Unlocked
Maximum frequency 3.70 GHz
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Max memory channels 12 6
Supported memory types DDR5-4800 DDR4-2666
Maximum memory size 768 GB
Supported memory frequency 2666 MHz

Compatibility

Configurable TDP 320-400 Watt
Max number of CPUs in a configuration 2
Package Size FC-LGA6096 76.0mm x 56.5mm
Sockets supported SP5 FCLGA3647
Thermal Design Power (TDP) 360 Watt 165 Watt
Low Halogen Options Available

Peripherals

Max number of PCIe lanes 128 48
PCI Express revision 5.0 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)